Effect of Co3+ substitution on the structure and magnetic properties of La0.6Ca0.4MnO3

Huang, Xusheng; Chen, Wen; Wu, Wenwei; Yuan, Zhenhong; Wu, Jiajin; Wang, Qing; Chen, Yuye

doi:10.1007/s10854-016-4440-6

Cited by 13 publications

(4 citation statements)

References 33 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure 6 shows the typical microstructure of a Sn-3.5Ag ball soldered to Ni where the nucleation undercooling was 8K. Note that this lower undercooling (relative to the freestanding solder balls in Figure 1 and to soldering to Cu substrates) is typical of soldering to Ni substrates [37,42]. In Figure 6A,B, the Sn microstructure is essentially single-grain with misorientations up to ~20 and the orientation is consistent with [110] growth from the substrate, similar to Sn-3Ag-0.5Cu/Cu and Sn-0.7Cu-0.05Ni/Cu joints.…”

Section: Tin Grain Structure In Solder Balls On Common Substratesmentioning

confidence: 96%

“…There is a wide scatter in undercooling measurements with little trend in undercooling versus cycle number and a mean undercooling of ~50K in each ball. Figure 1C compares the nucleation undercooling of Sn-0.7Cu-0.05Ni with past work on Sn-Ag-Cu solders [7,9,37] where undercooling is plotted versus the inverse solder ball diameter. Sn-0.7Cu-0.05Ni and Sn-Ag-Cu solders have similar size-undercooling trend but there is substantial difference in the magnitude of the undercooling for different authors.…”

Section: Nucleation Undercooling In Freestanding Solder Ballsmentioning

confidence: 98%

“…Various studies have found that the nucleation undercooling for tin can be reduced somewhat by the presence of a Cu or Ni-based substrate and that Ni substrates reduce undercooling more than Cu [8,10,37,42,43]. We find three key differences to the solidification of solder balls when soldered to Cu or Ni substrates: (i) the nucleation undercooling is usually significantly reduced, particularly in higher purity samples where the freestanding ball undercooling is high, (ii) Sn often grows from the substrate, and (iii) substrate dissolution can significantly change the phases that form during solidification, particularly when the substrate is not a component of the solder.…”

Section: Tin Grain Structure In Solder Balls On Common Substratesmentioning

confidence: 99%

See 2 more Smart Citations

Nucleation and Growth of Tin in Pb-Free Solder Joints

Gourlay

Belyakov

et al. 2015

JOM

View full text Add to dashboard Cite

The solidification of Pb-free solder joints is overviewed with a focus on the formation of the Sn grain structure and grain orientations. Three solders commonly used in electronics manufacturing, Sn-3Ag-0.5Cu, Sn-3.5Ag and Sn-0.7Cu-0.05Ni, are used as case studies to demonstrate that growth competition between primary dendrites and eutectic fronts during growth in undercooled melts is important in Pb-free solders, and that a metastable eutectic containing NiSn4 forms in Sn-3.5Ag/Ni joints. Additionally, it is shown that the substrate (metallization) has a strong influence on the nucleation and growth of tin. We identify Co, Pd and Pt substrates as having potential to control solidification and microstructure formation. In the case of Pd and Pt substrates, Sn is shown to nucleate on the PtSn4 or PdSn4 IMC reaction layer at relatively low undercooling of ~4K, even for small solder ball diameters down to <200 m. IntroductionThe transition to Pb-free electronic interconnections has been underway for more than a decade and despite the exemptions to the RoHS Directive there are few applications where Pb-free solders are not being used. At the same time, electronic packaging technologies have been advancing and there is an ongoing need to develop next-generation Pb-free solders and substrates that are better suited to smaller joints that can operate at higher temperature and that are more reliable.The most commonly used Pb-free solders are hypoeutectic or near-eutectic compositions from the Sn-Ag-Cu (SAC), Sn-Ag or Sn-Cu-Ni alloy systems. These compositions solidify with significant differences to the near-eutectic Sn-Pb solders used previously. For example, where the Sn-37Pb

show abstract

Section: Tin Grain Structure In Solder Balls On Common Substratesmentioning

confidence: 96%

Section: Nucleation Undercooling In Freestanding Solder Ballsmentioning

confidence: 98%

Section: Tin Grain Structure In Solder Balls On Common Substratesmentioning

confidence: 99%

See 1 more Smart Citation

Nucleation and Growth of Tin in Pb-Free Solder Joints

Gourlay

Belyakov

et al. 2015

JOM

View full text Add to dashboard Cite

show abstract

“…For instance, the charge ordering temperature (TCO) for Nd0.75Na0.25MnO3 and Pr0.75Na0.25MnO3 are recorded approximately at 170 K and 220 K respectively [14,15]. On the other hand, small substitution of magnetic Co 3+ at the Mn site of the manganese compound is believed to alter the properties due to the modification of Mn 3+ -O 2-Mn 4+ network [16][17][18]. It is well known that cobalt shoes different spin states resulting from the competition between values of crystal field splitting and Hund's coupling energy; low spin states ( e S = 2 for Co 3+ ) [19].…”

Section: Introductionmentioning

confidence: 99%

Effect Of Co3+ Substitution on Electro-Magnetic Properties of Pr¬0.75¬Na¬0.25¬mno¬3 ¬and Nd¬0.75¬Na¬0.25¬mno¬3¬ Manganites

Mannan¹,

Razali²,

Shamsuddin³

et al. 2018

IJET

View full text Add to dashboard Cite

This paper reports influences of cobalt (Co) substituted at Mn-site of Pr0.75Na0.25Mn1-xCoxO3 and Nd0.75Na0.25Mn1-yCoyO3 on structure, electrical transport and magnetic properties. All of the samples were prepared via standard solid state reaction method. X-ray diffraction measurement indicates that all samples were crystallized in an orthorhombic structure (space group Pnma). Resistivity measurement displays the x = 0 sample manifests an insulator behavior while metal-insulator transition was found at 108 K and 84 K for x = 0.02 and 0.05 respectively for Pr0.75Na0.25Mn1-xCoxO3. On the other hand, all of the samples for Nd0.75Na0.25Mn1-yCoyO3 showed insulator behavior down to low temperature and analysis of the resistivity change with respect to temperature, dlnρ/dT-1 versus T reveals a slope changes of resistivity have been recorded. Two obvious peaks were recorded from the analysis for y = 0.02 and 0.05 which can be suggested to the existence of charge order transition at the vicinity. For magnetic properties, x = 0 sample showed a paramagnetic-antiferromagnetic transition and further substitution of Co, x = 0.02 and 0.05, induce the paramagnetic-ferromagnetic transition and antiferromagnetic arrangement respectively. Meanwhile, further substitution of Co, y = 0.02 and 0.05 indicate antiferromagnetic transition with increasing TN as Co increased.

show abstract