2018
DOI: 10.1007/s00707-018-2196-1
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Effect of cooperative grain boundary sliding and migration on dislocation emission from interface collinear crack tip in nanocrystalline bi-materials

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Cited by 5 publications
(2 citation statements)
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“…The low strain hardening and strain softening observed in the Cu-24% Ta specimens are typical of nanostructured and nanocrystalline materials [65,66,67] because nanocrystalline grains are inherently unable to accumulate dislocations, unless dislocation motion can be obstructed through pinning, tangling, or locking [68]. Rather, in nanocrystalline materials, grain boundary dislocation emission and absorption occur readily because of the high number density of grain boundaries [69,70,71,72], leading to deformation by grain boundary sliding and migration [73,74,75,76,77] or grain rotation [72,78,79,80,81,82,83]. Similarly, micropillar compression and nanoindentation studies of Al/Al 3 Sc [84], Al/Nb [85], Cu/Zr [86], and Cu/Nb [87,88] nanolayers exhibit strain softening when nanolayer thicknesses are on the order of a few tens of nm.…”
Section: Strain Softeningmentioning
confidence: 99%
“…The low strain hardening and strain softening observed in the Cu-24% Ta specimens are typical of nanostructured and nanocrystalline materials [65,66,67] because nanocrystalline grains are inherently unable to accumulate dislocations, unless dislocation motion can be obstructed through pinning, tangling, or locking [68]. Rather, in nanocrystalline materials, grain boundary dislocation emission and absorption occur readily because of the high number density of grain boundaries [69,70,71,72], leading to deformation by grain boundary sliding and migration [73,74,75,76,77] or grain rotation [72,78,79,80,81,82,83]. Similarly, micropillar compression and nanoindentation studies of Al/Al 3 Sc [84], Al/Nb [85], Cu/Zr [86], and Cu/Nb [87,88] nanolayers exhibit strain softening when nanolayer thicknesses are on the order of a few tens of nm.…”
Section: Strain Softeningmentioning
confidence: 99%
“…In Sect. 3, benchmark examples are utilized to validate the effectiveness of the present solution and the parametric studies on the effects of mesh size, iterative number as well as the aspect ratio are investigated. The main concluding remarks are summarized in Sect.…”
Section: Introductionmentioning
confidence: 99%