Effect of copper nanoparticles on permeability, physical, and mechanical properties of particleboard

Taghiyari, Hamid Reza; Bibalan, Omid Farajpour

doi:10.1007/s00107-012-0644-5

Cited by 31 publications

(19 citation statements)

References 20 publications

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“…It can also be seen that adhesive polymerization in the inner layers occurred better, thereby increasing the internal bond strength of boards. These results confirm those obtained by Taghiyari et al [7][8][9][10][11][12] …”

Section: Internal Bond Strength (Ibs)supporting

confidence: 95%

“…In the meantime, enhancement in the thermal conductivity of nanofluids containing dispersed metallic nanoparticles has been studied in some research projects [5][6][7]. The heat transfer property of metal and mineral nanoparticles was reported to facilitate the heat transfer in solid wood and wood-composite materials [8][9][10]. Wollastonite nanofibers significantly increased the thermal conductivity coefficient in medium-density fiberboards by 11.5% [11].…”

mentioning

confidence: 99%

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The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste

Rangavar

Fard

2015

Mech Compos Mater

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The effect of addition of copper nanoparticles to a urea-formaldehyde (UF) adhesive on the physical and mechanical properties of particleboards manufactured from date palm waste (DPW) was investigated. The variable factors in the study included copper nanoparticles in amounts of 6 and 8 wt.% of the dry mass of wood, pressing durations of 5 and 6 min, and pressing temperatures of 150 and 160°C. The physical and mechanical properties of manufactured boards were measured according to EN standards. The results showed that the addition of copper nanoparticles to the UF adhesive considerably improved the physical and mechanical properties of the boards and shortened the pressing duration. The boards manufactured with 6 wt.% copper nanoparticles in a dry mass of wood mixed with the adhesive and pressed at a temperature of 160°C for 5 min had mechanical properties exceeding the EN312-2 standard levels.

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Section: Internal Bond Strength (Ibs)supporting

confidence: 95%

mentioning

confidence: 99%

The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste

Rangavar

Fard

2015

Mech Compos Mater

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“…Limiting UF resin consumption would have another privilege as far as the health issues are concerned: It will decrease formaldehyde emission in the living environment. Although utilization of UF resin is not restricted in some parts of the world (Taghiyari and Farajpour Bibalan 2013;Taghiyari et al 2014), its limitation to as much extent as possible would be beneficial to people. Using polyethylene in the particleboard matrix would not only improve …”

Section: Resultsmentioning

confidence: 99%

Improving physical and mechanical properties in particleboard by recycled polyethylene and canola residues

Rangavar

Taghiyari

Ghofrani

et al. 2015

Int. J. Environ. Sci. Technol.

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Improving effects of recycled polyethylene on dimensional stability, mechanical properties, and reduction in adhesive consumption of particleboard made from canola residues were studied here. Canola residues were consumed at 0, 30, and 50 % consumption levels, based on the dry weight of wood particles. Recycled low-density polyethylene was also consumed at two levels of 20 and 30 %. Urea-formaldehyde resin was used for all treatments at three levels (6, 8, and 10 %). Results showed that polyethylene had significant improving effects on all the physical and mechanical properties. Increase in canola content, however, increased modulus of rupture and modulus of elasticity due to the more slenderness ratio of canola residue, but it decreased the internal bond and physical properties because of the higher specific surface area of canola particles. Properties of the panels made from 30 % canola residues, 30 % polyethylene, and 8 % ureaformaldehyde resin were in compliance with the EN 312-2 standards. It can be concluded that the improving effects of recycled polyethylene can compensate for part of the ureaformaldehyde resin, and therefore, lower urea-formaldehyde content can be used, lowering the production costs due to high-value urea-formaldehyde resin. At the same time, the potentiality of formaldehyde emission into the atmosphere would also be decreased.

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“…By the abovementioned factors (1) to (4) can also be influenced application properties of PBs, for example, their swelling and strength [4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Biological Resistance and Application Properties of Particleboards Containing Nano‐Zinc Oxide

Reinprecht

Iždinský

Vidholdová

2018

Advances in Materials Science and Engineering

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Special particleboards (PBs) proposed for kitchens, bathrooms, hospitals, and some other specific products for interiors should have a sufficient resistance against bacteria, molds, and decaying fungi. is work deals about effects of zinc oxide nanoparticles (nano-ZnO) added into melamine-urea-formaldehyde (MUF) glue in the amounts of 0, 2, 6, 12, or 24% wt. on selected biological, moisture, and strength properties of laboratory-produced one-layer PBs. e nano-ZnO-treated PBs had a higher biological resistance: (1) against the Gram-positive bacterium Staphylococcus aureus by up to ca. 70% and the Gram-negative bacterium Escherichia coli by up to 50%, since their bacterial activities at using 1.0 McFarland bacterial inoculum decreased from 0.38-0.40 by up to 0.12-0.19 × 10 8 CFU/ml; (2) against the molds Penicillium brevicompactum and Aspergillus niger by up to ca. 50-63%, since their growth intensities (0-4) on the top surfaces of treated PBs decreased according to a modified EN 15457 from 2.33-2.67 by up to 1.17-1.0; (3) against the brown-rot fungus Coniophora puteana by up to 85.7%, since their weight losses reduced according to a modified ENV 12038 from 17.4% by up to 2.5%. e presence of nano-ZnO in PBs uninfluenced their swelling, water absorption, and bending strength; however, it decreased their internal bond strength by up to 38.8%.

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Effect of copper nanoparticles on permeability, physical, and mechanical properties of particleboard

Cited by 31 publications

References 20 publications

The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste

The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste

Improving physical and mechanical properties in particleboard by recycled polyethylene and canola residues

Biological Resistance and Application Properties of Particleboards Containing Nano‐Zinc Oxide

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