Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink

Oh, Gyung-Hwan; Hwang, H. Y.; Kim, Kwang Ho

doi:10.1039/c7ra01429e

Cited by 30 publications

(14 citation statements)

References 25 publications

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“…For inkjet printing, conductive inks based on silver [14][15][16][17][18][19][20] and copper [21][22][23][24][25] have been widely studied. Copper ink has received considerable attentions because of its relative high electrical conductivity and very low cost [26][27][28].…”

Section: Introductionmentioning

confidence: 99%

Effect of processing parameters on laser sintering of silver MOD inks for inkjet printing

Yang

Liu

Zhao

et al. 2019

IET Collaborative Intelligent Manufacturing

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Sintering is essential for inkjet printing and laser sintering is a promising sintering technology. In this study, the effect of laser sintering processing parameters on the sintering quality of silver content metal‐organic‐decomposition (MOD) inks is studied. A novel mathematic model is developed to reveal the temperature evolutions in MOD inks and the substrates during laser sintering. In the novel model, the change of thermal conductivity of MOD inks is taken into consideration for the first time to improve simulation accuracy. The simulation results agree well with the experiments, showing the advantages of the mathematic model. The surface morphology of the sintered MOD inks are also observed through experiments. The simulation and experimental results show that the laser sintering processing parameters have significant effects on the sintering quality. With authors’ optimised laser sintering processing parameters, the printed pattern can be sufficiently sintered and its electronic conductivity can reach 1.56 × 10–7 S/m. Thus, a sintering optimisation strategy is proposed based on the results. Finally, a microstrip antenna is fabricated with the optimised sintering strategy. The performance of the antenna agree well with the simulation results, indicating authors’ optimising strategy is useful for industrial production.

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Section: Introductionmentioning

confidence: 99%

Effect of processing parameters on laser sintering of silver MOD inks for inkjet printing

Yang

Liu

Zhao

et al. 2019

IET Collaborative Intelligent Manufacturing

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“…Cu oxide nanoparticles are more stable than their Cu nanoparticle counterparts. The IPL sintering can remove the oxide shells of Cu nanoparticles using the IPL-reactive protective agents, such as PVP, leaving a conductive Cu film in a short period of time (a few ms) under ambient conditions [ 100 , 101 , 102 , 103 , 104 , 105 , 106 , 107 ]. Ryu et al explained this phenomenon by oxide reduction either via an intermediate acid created by light irradiation or by hydroxyl (–OH) end groups, which act like long-chain alcohol reductants [ 100 ] ( Figure 11 ).…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

“…Oh et al reported the systematic investigation on the effect of Cu oxide shell thickness on the IPL sintering of PVP-protected Cu nanoparticle ink [ 104 ]. They prepared the Cu nanoparticles with different thicknesses of the Cu oxide shell, from 2.1 to 14 nm, by increasing the oxidation temperatures from 100 to 500 °C in the air.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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“…To resolve these issues, various research efforts have utilized alternative methods such as laser, microwave, and light sintering processes. The flash light sintering method has been studied since it can dramatically decrease the total process time to a few seconds when it sinters metals such as Cu and Ag under standard pressure and temperature conditions [28][29][30][31]. However, studies on the flash light sintering of ceramic materials is relatively insufficient.…”

Section: Introductionmentioning

confidence: 99%

Rapid Fabrication of Chemical Solution-Deposited Lanthanum Nickelate Thin Films via Intense Pulsed-Light Process

et al. 2019

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In this paper, we demonstrate the practicality and feasibility of the flash light-sintering method to fabricate the ceramic material perovskite structure for lanthanum nickel oxide (LaNiO3; LNO) thin films using flash light irradiation equipment. LNO thin films are deposited on an Si wafer and Al2O3 substrate via the chemical solution deposition (CSD) method and sintered by a thermal and flash light-irradiation process with a bottom heater. The properties of flash light-sintered LNO thin films are compared with those of thermally sintered films. The surface morphology, crystal development, and electric conductivity of the LNO thin films are measured by field-emission scanning electron microscope (FE-SEM), X-ray diffraction (XRD), and a four-point probe, respectively. Flash light sintering was accomplished in milliseconds. Through the comparison of thermal sintering and flash light-sintering results, it was confirmed that perovskite LNO thin films deposited by the CSD method can be fabricated by flash light sintering. We show that the flash light sintering method can solve several inherent issues of the conventional thermal sintering method.

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Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink

Abstract: In this study, the effect of the thickness of a copper oxide-shell on flash light sintering of Cu nanoparticles (NPs) was investigated.

Cited by 30 publications

References 25 publications

Effect of processing parameters on laser sintering of silver MOD inks for inkjet printing

Effect of processing parameters on laser sintering of silver MOD inks for inkjet printing

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Rapid Fabrication of Chemical Solution-Deposited Lanthanum Nickelate Thin Films via Intense Pulsed-Light Process

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