Effect of Cu concentration on the interfacial reactions between Sn-<i>x</i>Cu solders and Cu substrate

Bao, Nifa; Hu, Xiaowu; Li, Qinglin; Li, Shuang

doi:10.1088/2053-1591/ab181d

Cited by 6 publications

(1 citation statement)

References 37 publications

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“…Figure 9 shows the microhardness test results for the solidified Sn- x Cu solder. As indicated in Figure 9, the Vickers hardness number of the Sn- x Cu solder with a Cu content of 0.98 Wt.% was 12.15, and for Sn- x Cu alloys with Cu content of 1.33%, 2.48%, 4.25%, 5.49% and 11.62% by weight, they are 13.09, 14.11, 17.01, 17.85 and 21.12, respectively (Baoa et al , 2019). It became apparent that the microhardness of the solder alloys increased as the Cu percentage increased (from 0.98 to 11.62 Wt.%).…”

Section: Mechanical Propertiesmentioning

confidence: 93%

A review: effect of copper percentage solder alloy after laser soldering

Abdullah

Idris

2022

SSMT

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Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. Findings This paper presents a comprehensive overview of the composition of tin-copper (Sn-Cu) solders with a potential to enhance their microstructure, mechanical characteristics and wettability by varying the Cu percentage. The study found that the best Cu content in the Sn-xCu solder alloy was 0.6–0.7 Wt.%; this composition provided high shear strength, vibration fracture life value and ideal IMC thickness. A method of solder alloy preparation was also found through powder metallurgy and laser soldering to improve the solder joint reliability. Research limitations/implications This study focuses on interfacial reactions at the solder joint interface, solder joint morphology, modelling simulation of joint strength and the theory on characterising the formation and growth of IMC. Originality/value The paper comprehensively summarises the useful findings of the Sn-Cu series. This information will be important for future trends in laser soldering on solder joint formation.

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Section: Mechanical Propertiesmentioning

confidence: 93%