Effect of Cu(I) on electrochemical behavior and surface morphology of electrodeposited copper for different accelerators

Xiang, Jing; Qin, Ziwei; Xu, Ying; Zhang, Chong; Yang, Wei; Tian, Liangliang; Ruan, Haibo

doi:10.1007/s11581-023-04883-6

Cited by 7 publications

(2 citation statements)

References 41 publications

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“…It determines the quality of the final deposit [40]. Some of other parameters [41,42], such as deposition power and deposition pressure, also affect the deposition velocity [43]. Cu atoms are deposited vertically on the substrate surface in the negative Z direction, which makes the deposited atoms have strong atomic migration ability.…”

Section: Effect Of Different Deposition Velocity On Surface Qualitymentioning

confidence: 99%

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces

Ying,

Zewei,

Meiling

et al. 2024

Surf. Topogr.: Metrol. Prop.

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Copper (Cu) is used in integrated circuits and microdevices and has the potential to replace aluminum alloys due to its low resistivity, strong electromigration properties, and affordability. However, a significant factor that influences the performance of devices at the micro and nano scales is the surface roughness of the deposits. LAMMPS software is employed to simulate the deposition Cu on an ideal state for a stainless-steel substrate. The deposition process and deformation behavior of Cu on the surface and the roughness of the deposition surface are analyzed. Taking the deposition process of Cu atoms as an object, the effects of different atomic numbers, different temperatures, different velocities, and different heights on the surface roughness of the deposits were investigated. The atomic structure composition of the deposition velocity is analyzed, and the radial distribution function is analyzed to reveal the microscopic mechanism of action. The results of the theoretical deposition and analysis show that the surface roughness increases with the number of atoms deposited and decreases with increasing substrate temperature. The surface roughness first decreases and then, after some fluctuation, stays constant at a particular level with increasing velocity. Additionally, as the deposition height increases, the surface roughness reduces. There is a nonlinear relationship between the various components and the deposited surface roughness. The surface quality of deposits can be improved during the deposition process by optimizing the deposition parameters of deposition atoms, substrate temperature, deposition velocity, and deposition height.

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Section: Effect Of Different Deposition Velocity On Surface Qualitymentioning

confidence: 99%

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces

Ying,

Zewei,

Meiling

et al. 2024

Surf. Topogr.: Metrol. Prop.

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show abstract

“…Due to this reason, copper electrodeposited layers find numerous applications in nano-and micro-electronics [7], as well as as a decorative and protective layer [8]. To control the nano-and microstructure of the deposited copper layer, functional organic additives such as Cl − [9][10][11], MPS/SPS [2,[12][13][14][15][16], and PEG [17][18][19] are used. Benzotriazole is applied as a leveler that promotes deposition of a smooth copper surface by inhibition of copper adatom diffusion and passivation of growing copper islands by effective adsorption of BTA molecules on the copper surface [20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Mroczka

Słodkowska

2023

Molecules

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Benzotriazole (BTA) is an important compound that demonstrates the strongest anticorrosion properties of copper and plays a role as a leveler and an additive to the electroplating bath for control of the roughness and corrosion resistance of the electrodeposited copper layer. In this paper, we combined cyclic voltammetry (CV), time-of-flight secondary-ion mass spectrometry (TOF-SIMS), surface enhanced Raman spectroscopy (SERS), and atomic force microscopy (AFM) to study the interaction of BTA with copper surfaces at varied concentrations with and without the presence of chloride ions. We identified the most relevant molecular copper and its complex forms with BTA on the copper electrodeposited layer. BTA is adsorbed and incorporated into the copper surface in monomeric, dimeric, trimeric, tetrameric, and pentameric forms, inhibiting the copper electrodeposition. The addition of chloride ions diminishes the inhibiting properties of BTA. The Cu-BTA-Cl complexes were identified in the forms C12H8N6Cu2Cl− and C6H4N3CuCl−. Coadsorption of chloride ions and BTA molecules depends on their concentration and applied potential. Chloride ions are replaced by BTA molecules. BTA and chloride ions, depending on their concentration and applied potential, control the copper nucleation processes at the micro- and nanoscales. We compared the abilities and limitations of TOF-SIMS and SERS for studies of the interactions of benzotriazole with copper and chloride ions at the molecular level.

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Roles and influencing mechanisms of Fe2+ and Lix984 in copper electrodeposition

Zhong,

Lin,

Sheng

et al. 2024

Ionics

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Effect of Cu(I) on electrochemical behavior and surface morphology of electrodeposited copper for different accelerators

Cited by 7 publications

References 41 publications

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces

Studies of Benzotriazole on and into the Copper Electrodeposited Layer by Cyclic Voltammetry, Time-of-Flight Secondary-Ion Mass Spectrometry, Atomic Force Microscopy, and Surface Enhanced Raman Spectroscopy

Roles and influencing mechanisms of Fe2+ and Lix984 in copper electrodeposition

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