Effect of Curing Temperature and Curing Degree on Elastic Recovery of Conductive Particles

Gong, Mali; Zhou, Dejian

doi:10.2991/ap3er-15.2015.43

Cited by 1 publication

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Fully cured adhesives were obtained at a T cure of 150-210°C because there is no significant difference in σ ad and because of the physical appearance in this range. The low σ ad region at a low T cure between 90 and 150°C may indicate incomplete curing because the incomplete network structures of a partially cured adhesive result in a remarkably lower elastic modulus [35]. The experimental evidence shows that an adhesive cured at 90°C is relatively soft and/or the resin component remains liquid (uncured) compared with that cured at 170-210°C.…”

Section: Interpretation Of ML Model For Adhesive Designmentioning

confidence: 95%

Prediction and optimization of epoxy adhesive strength from a small dataset through active learning

Pruksawan

Lambard

Samitsu

et al. 2019

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

Machine learning is emerging as a powerful tool for the discovery of novel high-performance functional materials. However, experimental datasets in the polymer-science field are typically limited and they are expensive to build. Their size (< 100 samples) limits the development of chemical intuition from experimentalists, as it constrains the use of machine-learning algorithms for extracting relevant information. We tackle this issue to predict and optimize adhesive materials by combining laboratory experimental design, an active learning pipeline and Bayesian optimization. We start from an initial dataset of 32 adhesive samples that were prepared from various molecular-weight bisphenol A-based epoxy resins and polyetheramine curing agents, mixing ratios and curing temperatures, and our data-driven method allows us to propose an optimal preparation of an adhesive material with a very high adhesive joint strength measured at 35.8 ± 1.1 MPa after three active learning cycles (five proposed preparations per cycle). A Gradient boosting machine learning model was used for the successive prediction of the adhesive joint strength in the active learning pipeline, and the model achieved a respectable accuracy with a coefficient of determination, root mean square error and mean absolute error of 0.85, 4.0 MPa and 3.0 MPa, respectively. This study demonstrates the important impact of active learning to accelerate the design and development of tailored highly functional materials from very small datasets.

show abstract

Section: Interpretation Of ML Model For Adhesive Designmentioning

confidence: 95%