Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Yang, Li; Wu, Haodong; Zhang, Yaocheng; Lu, Kaijian; Lin, Qiusheng

doi:10.1007/s40194-023-01621-4

Weld World

2023

DOI: 10.1007/s40194-023-01621-4

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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Li Yang,

Haodong Wu,

Yaocheng Zhang

et al.

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2024

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Cited by 4 publications

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Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding

Cited by 4 publications

References 34 publications

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Composition design, microstructure and mechanical properties of bismuth-doped In–Sn-based low-temperature solder alloy

Effect of bonding time on reliability of Cu/Sn-9Zn-30Cu/Cu solder joints for 3D packaging

Cu–Cu joint with great strength using In/Sn–58Bi hybrid soldering at low temperature (90 °C)

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