2013
DOI: 10.1109/lpt.2013.2248352
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Effect of Deep N-Well Bias in an 850-nm Si Photodiode Fabricated Using the CMOS Process

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Cited by 26 publications
(9 citation statements)
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“…4 due to higher electric field nearby the NW1 port. Whereas with the 1 V different bias voltage the proposed device doesn't suffer from the problem of high dark current [20] and [21], our device shows 4 times better responsivity and 8 times higher photodetection bandwidth, respectively. Compared with our previous work [15], which is based on the same P + /N-well structure in more advanced CMOS technology, the proposed device shows lower bandwidth mainly because of larger diffusion time due to deeper N-well in 0.25 µm process, but it is expected that higher bandwidth than 7.6 GHz is achieved if the proposed device is realized in the same CMOS technology.…”
Section: Simulation and Measurement Resultsmentioning
confidence: 92%
“…4 due to higher electric field nearby the NW1 port. Whereas with the 1 V different bias voltage the proposed device doesn't suffer from the problem of high dark current [20] and [21], our device shows 4 times better responsivity and 8 times higher photodetection bandwidth, respectively. Compared with our previous work [15], which is based on the same P + /N-well structure in more advanced CMOS technology, the proposed device shows lower bandwidth mainly because of larger diffusion time due to deeper N-well in 0.25 µm process, but it is expected that higher bandwidth than 7.6 GHz is achieved if the proposed device is realized in the same CMOS technology.…”
Section: Simulation and Measurement Resultsmentioning
confidence: 92%
“…In order to realize the optical interconnection, it is necessary to integrate optical devices such as light sources, optical waveguides, photodetectors with electronic circuits. A number of researches on Ge photodetectors on Si substrate have been studied for a long wavelength band, while a number of researches on photodetectors fabricated by CMOS process are also studied for short wavelength band [1]- [5], and optical receivers have been demonstrated [6]- [12]. By using CMOS process, it is possible to easily integrate photodetectors and electronic circuits on same Si substrate with low-cost because CMOS process is mature process.…”
Section: Introductionmentioning
confidence: 99%
“…In these applications, short wavelength vertical-cavity surface-emitting lasers (VCSELs) and silicon (Si) photodiodes (PDs) are used for low-cost system configuration. Si PDs fabricated by CMOS process are promising optical devices for easy integration with electronic circuits without any process modification [4][5][6], and avalanche photodiodes fabricated by CMOS process (CMOS-APDs) have been developed for optical interconnection applications [7][8][9][10]. The bandwidth of the CMOS-APD, however, is limited by slow photo-generated carriers from the substrate because all the electrodes are arranged on the surface of the substrate.…”
Section: Introductionmentioning
confidence: 99%