Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package

Azahar, Ahmad Zarif; Bakar, Maria Abu; Jalar, Azman; Ani, Fakhrozi Che

doi:10.1007/s11665-023-09028-4

J. of Materi Eng and Perform

2023

DOI: 10.1007/s11665-023-09028-4

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Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package

Ahmad Zarif Azahar,

Maria Abu Bakar,

Azman Jalar

et al.

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Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package

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References 37 publications

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