2023
DOI: 10.1002/pc.27815
|View full text |Cite
|
Sign up to set email alerts
|

Effect of different microcapsule types on the wear mechanism of PTFE/aramid fiber composite liners

Xiaocui Yan,
Shifa Pang,
Xiaowen Qi
et al.

Abstract: In this study, three different methods based on vacuum adsorption, solvent volatilization, and Pickering emulsion were utilized to prepare microcapsules with the core material of PAO40 and the wall materials of SiO2, polysulfone (PSF), and PSF/SiO2 composites, respectively. PTFE/Kevlar fabric liners were modified by PAO40/SiO2 microcapsules (PSMS), PAO40/PSF microcapsules (PPMS), and PAO40/PSF/SiO2 microcapsules (PPSMS). The effect of microcapsules based on different wall materials on the tribological properti… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 38 publications
0
2
0
Order By: Relevance
“…For microcapsules, organic wall materials are often used, such as polyurea-formaldehyde(PUF), [23][24][25][26] polysulfone(PSF) [27][28][29][30][31][32] and polystyrene(PS) 33,34 et al Their serious disadvantage is that the thermal decomposition temperature or thermal softening temperature is low, which will make their applications in polymer matrix requiring high temperature processing and the application in the field of high temperature friction are all limited. These microcapsules were often applied in epoxy resin and thermoplastic polyurethane composites, which did not require higher processing temperature.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…For microcapsules, organic wall materials are often used, such as polyurea-formaldehyde(PUF), [23][24][25][26] polysulfone(PSF) [27][28][29][30][31][32] and polystyrene(PS) 33,34 et al Their serious disadvantage is that the thermal decomposition temperature or thermal softening temperature is low, which will make their applications in polymer matrix requiring high temperature processing and the application in the field of high temperature friction are all limited. These microcapsules were often applied in epoxy resin and thermoplastic polyurethane composites, which did not require higher processing temperature.…”
Section: Introductionmentioning
confidence: 99%
“…To solve this problem, organic/inorganic or organic/metal hybrid wall microcapsules are designed. PSF/GO, 29,30 PSF/ SiO 2 , [35][36][37][38][39] PS/SiO 2 33 and PSF/Ni 40 microcapsules have been prepared and applied in self-lubricating polymer. GO, SiO 2 and Ni have all excellent thermal stability, they can effectively protect the softening deformation of organic wall materials, so that the microcapsules can meet the needs of high temperature processing of polymers.…”
Section: Introductionmentioning
confidence: 99%