Abstract:Nylon 6 (PA6) thermal conductive composites were prepared by melt blending with different sizes of spherical Al 2 O 3 and AlN and the filling amount was 60 wt%. This paper explored the effects of different particle sizes and filler kinds on the thermal conductivity and mechanical properties of the composites. The results showed that the composites filled with AlN and spherical Al 2 O 3 had higher thermal conductivity than the composites filled with single filler under the same filling amount. When the mass rat… Show more
“…Besides, the incorporation of different-sized Al 2 O 3 endows composites with better thermal diffusion coefficient, which may be concluded to better distribution of Al 2 O 3 within the composite. 32 Figure 8.Thermal conductivity and thermal diffusion coefficient of sample n (a) n = 1, 2, 3…8 (b) n = 9, 10, 11…16 (c) PE, S20, S30, S50 and S70.…”
Section: Resultsmentioning
confidence: 99%
“…16,26,30,31 In addition to the type of fillers, filler size, shape and content also affect the performance of the composite material. [32][33][34][35][36] Zhao et al 37 prepared an epoxy-based material using the BN sheets and microspheres, where the BN microspheres play a role of bridge to connect the adjacent flakes. The composites with a filler loading of 30 wt % exhibited a thermal conductivity of 1.148 WÁm À1 ÁK À1 .…”
Taking advantages of excellent adhesion and insulating properties, polymer-based thermal interface materials have been widely used in electrical and electronic industry. However, applications was limited due to the existence of high interfacial resistance and poor mechanical properties resulted from poor dispersion and weak interfacial adhesion of thermal conductive fillers in the polymer matrix. Herein, different sizes of aluminum oxide microparticle was used as thermal conductive fillers to fabricate a series of high thermal conductive epoxy composites, and the effect of fillers loading ratio on the properties of thermal conductive, mechanical, thermal stability was further analyzed. The optimum composite exhibits a high thermal conductivity (1.91 ± 0.02 W·m−1·K−1) at a loading ratio of 1: 2 (20-μm: 70-μm, mass ratio), which is equivalent to a thermal conductivity enhancement of 950% in comparison with pure epoxy resin. The outstanding properties of the as-prepared composite is mainly attributed to the effective conductive network formed by different size fillers that the smaller particles act as a bridge to connect the larger one. This work has proved by Agari model that combining different sizes Al2O3 as fillers is a workable way to obtain composite with high thermal conductivity and it is expected to provide a reliable route for the preparation of thermally conductive composites with different particle sizes.
“…Besides, the incorporation of different-sized Al 2 O 3 endows composites with better thermal diffusion coefficient, which may be concluded to better distribution of Al 2 O 3 within the composite. 32 Figure 8.Thermal conductivity and thermal diffusion coefficient of sample n (a) n = 1, 2, 3…8 (b) n = 9, 10, 11…16 (c) PE, S20, S30, S50 and S70.…”
Section: Resultsmentioning
confidence: 99%
“…16,26,30,31 In addition to the type of fillers, filler size, shape and content also affect the performance of the composite material. [32][33][34][35][36] Zhao et al 37 prepared an epoxy-based material using the BN sheets and microspheres, where the BN microspheres play a role of bridge to connect the adjacent flakes. The composites with a filler loading of 30 wt % exhibited a thermal conductivity of 1.148 WÁm À1 ÁK À1 .…”
Taking advantages of excellent adhesion and insulating properties, polymer-based thermal interface materials have been widely used in electrical and electronic industry. However, applications was limited due to the existence of high interfacial resistance and poor mechanical properties resulted from poor dispersion and weak interfacial adhesion of thermal conductive fillers in the polymer matrix. Herein, different sizes of aluminum oxide microparticle was used as thermal conductive fillers to fabricate a series of high thermal conductive epoxy composites, and the effect of fillers loading ratio on the properties of thermal conductive, mechanical, thermal stability was further analyzed. The optimum composite exhibits a high thermal conductivity (1.91 ± 0.02 W·m−1·K−1) at a loading ratio of 1: 2 (20-μm: 70-μm, mass ratio), which is equivalent to a thermal conductivity enhancement of 950% in comparison with pure epoxy resin. The outstanding properties of the as-prepared composite is mainly attributed to the effective conductive network formed by different size fillers that the smaller particles act as a bridge to connect the larger one. This work has proved by Agari model that combining different sizes Al2O3 as fillers is a workable way to obtain composite with high thermal conductivity and it is expected to provide a reliable route for the preparation of thermally conductive composites with different particle sizes.
“…The hybrid filler network shortens the distance between fillers, avoids heat passing through the matrix with low thermal conductivity, and promotes heat conduction. Li et al [ 132 ] introduced hybrid spherical alumina with a diameter of 18 μm and 48 μm into nylon 6, and the influence of the ratio of different particle sizes on the thermal conductivity of the composite was systematically studied. It was found that the thermal conductivity of the prepared composite with hybrid fillers at various mass ratios was always higher than that achieved by a single particle size filler.…”
Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning
With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.
“…Burda et al 28 used nano silica particles, micron rubber and micron calcium carbonate as fillers to fill the oxygen re‐oxidizing resin matrix, and the fracture toughness increased by 60%. Li et al 29 prepared nylon 6 (PA6) thermal conductive composite by melting blending containing AlN and spherical Al 2 O 3 of different sizes. Under the same filler content, the thermal conductivity and thermal diffusivity of the composites filled with AlN and spherical Al 2 O 3 was 2.44 W/m K and 0.72 mm 2 /s, respectively, which were higher than those of the composites filled with single filler.…”
Thermoplastic polyurethane (TPU) nanocomposites (TPU/μmAl2O3‐ACA/nmAl2O3) with excellent mechanical, thermal stability and thermal conductivity were fabricated by co‐incorporating aluminate coupling agent DL‐411 chemically functionalized micron Al2O3 (μmAl2O3‐ACA) and nano‐Al2O3 (nmAl2O3) through melt blending method. FTIR analysis indicated that DL‐411 has been successfully grafted on the surface of μmAl2O3, which was beneficial to the homogeneous dispersion of Al2O3 particles and enhancements of interfacial interactions between Al2O3 particles and TPU matrix. Adding μmAl2O3‐ACA and nmAl2O3 simultaneously showed obvious synergistic effects on improving the mechanical properties of TPU nanocomposites. The optimum mechanical properties were obtained at the mass ratio of μmAl2O3‐ACA to nmAl2O3 of 3:1. Both μmAl2O3‐ACA and nmAl2O3 particles were homogeneously dispersed, constructing relatively perfect thermal conductivity networks, as verified by FESEM and PLM observations. The thermal conductivity (k) of TPU nanocomposites increased continuously with the addition of μmAl2O3‐ACA/nmAl2O3 particles, and the optimal k (0.28 W/m K) was achieved when the mass ratio of μmAl2O3‐ACA to nmAl2O3 was 3:1, which increased by 53% compared with pure TPU (k = 0.183 W/m K). TGA showed that, in contrast to those of pure TPU, the maximum decomposition temperature of TPU/μmAl2O3‐ACA/nmAl2O3 nanocomposites increased by 77.77°C, and the decomposition activation energy of TPU nanocomposite enhanced by 178%.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
