2011
DOI: 10.2514/1.50255
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Effect of Dimple Configuration on Heat Transfer Coefficient in a Rotating Channel

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Cited by 18 publications
(3 citation statements)
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“…Moon and Lau [11] reported that cylindrical pits have a higher heat transfer coefficient and lower flow resistance than spherical pits. Some studies [12][13][14][15] have reported on the influences of dimple parameters on heat transfer and pressure loss characteristics in a dimple-roughened channel in terms of dimple depth, print diameter, spacing and arrangement. Bilen et al [16] and Ramadhan et al [17] studied the effects of different groove shapes (circle, rectangle, trapezoid, and triangle) on the heat transfer performance and flow loss of a channel.…”
Section: Experimental Equipmentmentioning
confidence: 99%
“…Moon and Lau [11] reported that cylindrical pits have a higher heat transfer coefficient and lower flow resistance than spherical pits. Some studies [12][13][14][15] have reported on the influences of dimple parameters on heat transfer and pressure loss characteristics in a dimple-roughened channel in terms of dimple depth, print diameter, spacing and arrangement. Bilen et al [16] and Ramadhan et al [17] studied the effects of different groove shapes (circle, rectangle, trapezoid, and triangle) on the heat transfer performance and flow loss of a channel.…”
Section: Experimental Equipmentmentioning
confidence: 99%
“…The results showed that for particles with small particle sizes (dp < 20 µm), the thermal network deposition led to a sharp increase in the particle deposition rate, but for particles with larger particle sizes (dp > 20 µm), it remained constant. The literature [28][29][30][31] reports on the effect of parameters such as dimple depth, dimple diameter, dimple spacing, and dimple arrangement on the heat transfer and pressure loss characteristics within the dimple roughened channel. Dimple structures are also commonly used in various engineering applications for enhanced heat transfer, such as heat exchangers [32,33] and cooling devices for electronic components [34].…”
Section: Introductionmentioning
confidence: 99%
“…Afanasyev et al [9] conducted one of the early investigations on the heat transfer and friction characteristics of a shallow-dimpled plate. Subsequently, many researches on the heat transfer and pressure loss penalty in dimpled channels are focused on the dimple parameters in terms of the dimple depth, dimple print diameter, dimple spacing and dimple arrangements [10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%