Effect of Dissolved Oxygen for Advanced Wet Processing

Abstract

of these new materials have necessitated the evaluation of new chemicals and processing methods. The control of the Dissolved Oxygen (DO) concentration to suppress Cu corrosion is well established in BEOL processing and likewise in order to achieve a hydrophobic surface after pre-epi cleaning in FEOL surface preparation [2].

Oxygen Control Challenge for Advanced Wet Processing

“…Previous studies had focused on how to improve the process hardware to reduce the Dissolved Oxygen (DO) concentration in liquid and oxygen concentration in ambient environment in wet processing. [7] This study focused on the effect of low DO condition for integration schemes, particularly three cases of defect formation were used as representative metrics for the performance: the voids on Ge, the trench-formation in RMG on doped Si and nano particle reduction related to water marks on Si substrate.…”