Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process

Imai, Masahiko; Yamashita, Yukinari; Futatsuki, T.; Shiohara, Morio; Kondo, Seiichi; Saito, Shuichi

doi:10.1143/jjap.48.04c023

Cited by 12 publications

(16 citation statements)

References 3 publications

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“…Copper reacts with dissolved oxygen and forms at first cuprous oxide which reacts with oxygen to procedure cupric oxide. These copper oxides react with the available anions in the vicinity to form compounds further (Imai et al, 2009;Lee et al, 2016;Zakowski et al, 2014). The time delay in the formation of copper oxides and development period of the patina in stable state might be the reason for the highest corrosion rate to be occurred at the initial attack period.…”

Section: Figurementioning

confidence: 99%

Corrosion Behavior of Copper Based Heat Exchanger Tube in Waters of Bangladesh Region at Varied Temperature and Flow Velocity

Rahman¹,

Ahmed

2020

MIST International Journal of Science and Technology

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Heat exchangers used in the ships are mostly of water-cooled shell and tube type, whose tube stacks are made of copper-based materials due to the requirement of high corrosion resistance and high thermal conductivity. Even though, the copper made heat exchanger tubes do fail on board ships because of corrosion. More point of contention arises when it is manufactured by companies that have limited supporting data and documentations. In this context, the present paper investigates the corrosion behavior of copper tubes of heat exchanger to assess the life span of the tube stack for on-board applications. A series of experiments have been undertaken to investigate the corrosion rates of copper tubes in sea water and river water with flow velocity of 1.0 m/s, 1.5 m/s and 2.0 m/s for the tube side entry temperature of 20°C. The same experiments have been repeated for the shell side temperatures of 20°C, 40°C, 60°C and 80°C. The investigations have revealed that the corrosion in sea water is about three times higher than that of river water. The increases in temperature and flow velocity have increased the rate of corrosion to a significant level contributing to shorten the life span.

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Section: Figurementioning

confidence: 99%

Corrosion Behavior of Copper Based Heat Exchanger Tube in Waters of Bangladesh Region at Varied Temperature and Flow Velocity

Rahman¹,

Ahmed

2020

MIST International Journal of Science and Technology

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“…Imai et al [ 21 ] investigated the effect of dissolved oxygen in DIW on the corrosion of Cu during the wafer-cleaning process and revealed that the etch rate of Cu increased as the dissolved oxygen increased. They reported that the Cu surface was ionized by DIW with a high dissolved-oxygen content.…”

Section: Resultsmentioning

confidence: 99%

“…They reported that the Cu surface was ionized by DIW with a high dissolved-oxygen content. The oxidation mechanism of copper by dissolved oxygen is as follows [ 21 ]:

…”

Section: Resultsmentioning

confidence: 99%

Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes

Lee

2023

Micromachines

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Recently, various efforts have been made to reduce the environmental burden caused by semiconductor manufacturing by improving the process efficiency. Chemical mechanical polishing (CMP), which is used to planarize thin films in semiconductor production, has also been studied to improve its efficiency by increasing the material removal rate (MRR) while reducing its environmental burden. Previous studies have been conducted to electrolytically ionize chemical solutions used in abrasive-free CMP for improving the MRR. In this study, we analyzed the change in the chemical solution according to the variation in voltage applied to the nickel (Ni) electrode in abrasive-free Cu CMP and studied the tribological material removal characteristics. The experimental results revealed that electrolytic ionization of the chemical solution for abrasive-free CMP increases the amount of dissolved oxygen (DO). The static etch rate of the Cu thin film and MRR in CMP increased as the voltage applied to the Ni electrode increased. The frictional force and temperature during CMP also increased as the applied voltage increased. Therefore, the increase in MRR caused by the increase in the applied voltage in abrasive-free Cu CMP using electrolytic ionization is plausibly caused by the chemical reaction between the dissolved oxygen in the chemical solution and Cu.

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“…Copper reacts with dissolved oxygen and forms at first cuprous oxide which reacts with oxygen to procedure cupric oxide. These copper oxides react with the available anions in the vicinity to form compounds further (Imai et al, 2009;Zakowski et al, 2014). The time delay in the formation of copper oxides and development period of the patina in stable state might be the reason for the highest corrosion rate to be occurred at the initial attack period.…”

Section: Figurementioning

confidence: 99%

“…Figure 3: Corrosion rate against corrosion period for the variation of operating temperature with the river water flow velocity of 1.0 / After 30 days of operations, corrosion rates are found to be almost steady showing minimum values.Copper reacts with dissolved oxygen and forms at first cuprous oxide which reacts with oxygen to procedure cupric oxide. These copper oxides react with the available anions in the vicinity to form compounds further(Imai et al, 2009;Zakowski et al, 2014). The time delay in the formation of copper oxides and development period of the patina in stable state might be the reason for the highest corrosion rate to be occurred at the initial attack period.The thermal effect on corrosion rate is as like that of weight loss, i.e., higher corrosion rate is witnessed for higher operating temperature.…”

mentioning

confidence: 99%