2011
DOI: 10.1063/1.3556783
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Effect of duty ratio of patterned surface on planarization by gas cluster ion beams

Abstract: We studied the effect of the duty ratio, i.e., the ratio of hill width to pitch, of patterned diamondlike carbon (DLC) surfaces on Ar gas cluster ion beam (GCIB) planarization effect. The patterns of 40 nm depth were fabricated on Si substrates by electron beam lithography and CHF 3 reactive-ion etching. The pitch of the line-and-space pattern was 300 nm and three duty ratios were adopted. Then, refilling materials were deposited to 50 nm thickness on the patterned substrates. The test samples were irradiated … Show more

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Cited by 4 publications
(6 citation statements)
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“…A naïve view would suggest that Ar ion beam milling at normal incidence would maintain this conformal pattern through the entire milling process, yielding no pattern transfer to the NiFe layer. However, because of effects such as resputtering occurring within the dimple features, planarization of the surface occurs (a well-documented phenomenon ). By 15 min of milling (Figure b) more than 80% of the dimples are no longer visible with the remainder being considerably shallower than in the original overlayer (Figure a), as indicated by the weaker contrast and smaller diameter in AFM and SEM images.…”
Section: Resultsmentioning
confidence: 99%
“…A naïve view would suggest that Ar ion beam milling at normal incidence would maintain this conformal pattern through the entire milling process, yielding no pattern transfer to the NiFe layer. However, because of effects such as resputtering occurring within the dimple features, planarization of the surface occurs (a well-documented phenomenon ). By 15 min of milling (Figure b) more than 80% of the dimples are no longer visible with the remainder being considerably shallower than in the original overlayer (Figure a), as indicated by the weaker contrast and smaller diameter in AFM and SEM images.…”
Section: Resultsmentioning
confidence: 99%
“…Another important application of the WLI method to sputter depth profiling is exemplified by the sputtering time to sputtered depth calibration procedure applied to this particular experiment. The samples analyzed here were pieces of Si(001) wafer implanted with 25 Mg + , 44 Ca + and 53 Cr + ions at energy of 1 keV per atomic mass unit (25 keV for 25 Mg, 44 keV for 44 Ca and 53 keV for 53 Cr, all at 3×10 13 ions/cm 2 fluence) fabricated by Leonard Kroko Inc. A TOF MS analysis of these samples was performed by laser post-ionization of sputtered neutrals (secondary neutral mass spectrometry, SNMS) using resonantly enhanced multi-photon ionization to simultaneously detect all isotopes of Mg, Ca and Cr [23]. This was an experiment on sputter depth profiling which started in the DB mode as described above but, after the concentration peaks of the implants were passed (that is, after 170 nm on the depth scale in Fig.…”
Section: Multiple Beam System Alignment and Time-to-depth Conversionmentioning
confidence: 99%
“…In this example, the depth resolution of the WLI technique applied to characterization of Si surfaces irradiated with gas cluster ion beams (GCIB) is demonstrated. The GCIB in these sputtering experiments was an argon cluster beam Ar + N with N =2000, where N corresponds to the number of atoms in the peak distribution and, in general, can lie between 200 and 10000 [24,25]. Irradiating materials surfaces with such cluster ions causes two unique 25 Mg (wine circles), 44 Ca (green squares), 53 Cr (blue diamonds) implanted in Si host matrix at 1 keV per nucleon (1 keV/amu).…”
Section: Quantitative Characterization Of Ultra-shallow Surface Proce...mentioning
confidence: 99%
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