Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate

Beom, Hyeon Gyu; Jang, Ho Su

doi:10.1007/s00419-013-0766-1

Cited by 4 publications

(2 citation statements)

References 21 publications

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“…Lee et al [4] developed a mathematical formulation for the penetration of vertical cracks into epitaxial film/substrate systems caused by residual stress between the interfaces. Beom and Jang [5] analyzed a steady-state channeling crack in an orthotropic thin-film bonded to an orthotropic substrate to determine the essential material parameters required to obtain the energy release rate.…”

Section: Introductionmentioning

confidence: 99%

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

Shim¹,

Go²,

Beom³

2021

Materials

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In this study, tensile tests on aluminum/silicon vertically cracked nanofilm/substrate systems were performed using atomistic simulations. Various crystallographic orientations and thicknesses of the aluminum nanofilms were considered to analyze the effects of these factors on the reliability of the nanofilm/substrate systems. The results show that systems with some specific crystallographic orientations have lower reliability compared to the other orientations because of the penetration of the vertical crack into the silicon substrate. This penetration phenomenon occurring in a specific model is related to a high coincidence of atomic matching between the interfaces in the model. This high coincidence leads to a tendency of the interface to maintain a coherent form in which the outermost silicon atoms of the substrate that are bonded to the aluminum nanofilm tend to stick with the aluminum atoms under tensile loads. This phenomenon was verified by interface energy calculations in the simulation models.

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Section: Introductionmentioning

confidence: 99%

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

Shim¹,

Go²,

Beom³

2021

Materials

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“…Tunneling cracks have been modelled extensively through the last three decades using linear elastic fracture mechanics (LEFM) [22,23,24,25,19,26,27]. From a modelling perspective, this cracking mechanism is closely related to channeling cracks in thin films [28,29,30,31,32]. One of the first models of a single tunneling crack embedded in-between thick substrates were developed using 2D finite element (FE) modelling and LEFM [22,23,24].…”

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confidence: 99%

Tunneling cracks in full scale wind turbine blade joints

Jørgensen

Sørensen

Kildegaard³

2018

Engineering Fracture Mechanics

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A novel approach is presented and used in a generic tunneling crack tool for the prediction of crack growth rates for tunneling cracks propagating across a bond-line in a wind turbine blade under high cyclic loadings. In order to test and demonstrate the applicability of the tool, model predictions are compared with measured crack growth rates from a full scale blade fatigue test. The crack growth rates, measured for a several metre long section along the blade trailing-edge joint during the fatigue test, are found to be in-between the upper-and lower-bound predictions.

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Oblique edge crack in an orthotropic material under thermal loading

Jang

Beom

2014

Arch Appl Mech

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Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate

Cited by 4 publications

References 21 publications

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

Effects of Geometric and Crystallographic Factors on the Reliability of Al/Si Vertically Cracked Nanofilm/Substrate Systems

Tunneling cracks in full scale wind turbine blade joints

Oblique edge crack in an orthotropic material under thermal loading

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