Effect of electric field on chemical mechanical polishing of langasite

Lim, Dae Soon; Yoon, In Ho; Danyluk, S.

doi:10.1016/s0043-1648(01)00544-0

Cited by 7 publications

(4 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, the chemical effect was not considered. (2)The rigid polishing plate and stretchy cushion absorbs the distortion caused by the temperature change [9,10]. Hence, the effects of temperature were ignored.…”

Section: Fig 1 Pe-1 Style Of Ultra-precision Planar Polishing Machinementioning

confidence: 99%

Research of the Virtual Prototyping and Simulating on Ultra-Precision Double-Sided Planar Polishing Machine

Zhao

Wen

et al. 2009

AMR

View full text Add to dashboard Cite

Based on virtual prototyping technology, dynamic simulation of PE-1 type ultra-precision double-sided polishing machine and its technologic parameter optimization was studied. Through the simulation of virtual prototype, which was built in ADAMS, the polishing process was analyzed. Firstly, the simulation of polishing process shows that the ratio of rotation and revolution angular speed is inversely proportional to input speed ratio of planetary system. Secondly, the simulation of movement route shows that points along the same radius have similar route style considering the same input speed ratio of planetary system. Thirdly, the optimization of material removal non-uniformity shows that the higher speed makes for higher removal quality, the speed of solar gear and gear ring is opposite when the optimum value reached. At last, the maximum removal rate was achieved on the condition of same press and speed of plate, and corresponding solar gear speed and gear ring speed were gained.

show abstract

Section: Fig 1 Pe-1 Style Of Ultra-precision Planar Polishing Machinementioning

confidence: 99%

Research of the Virtual Prototyping and Simulating on Ultra-Precision Double-Sided Planar Polishing Machine

Zhao

Wen

et al. 2009

AMR

View full text Add to dashboard Cite

show abstract

“…Because of the synergetic chemicalmechanical actions, the polishing efficiency can be several folds or tens folds higher than that of mechanical polishing. The process on the basis of this principle is known as chemical-mechanical polishing (CMP), which has become the key technique of super-precision manufacturing for wafers, and is widely applied to surface polishing and planarization for semiconductors [30,31], piezoelectric materials [32], interlayer dielectric [33] and interconnect materials [34] of integrated circuit (IC) wafers.…”

Section: Introduction Of Polishing Principlesmentioning

confidence: 99%

Research progress in tribo-electrochemistry and tribo-electrochemical polishing

Zhai

2007

Front. Mech. Eng. China

View full text Add to dashboard Cite

In this paper, the status quo and recent progress in the research on tribo-electrochemistry in aqueous and non-aqueous media, respectively, are reviewed. Much more attention has been paid to the tribo-electrochemical mechanisms for the control of friction and wear. Based on a summary of the conventional polishing principles of hard and brittle materials, the tribo-electrochemical polishing method is proposed. The results of the preliminary test show that tribo-electrochemical polishing is promising to become a critical technology in the high efficient polishing and planarization of microelectronic materials.

show abstract

“…The relations between wear and mechanical properties are examined in [14,15], and an extensive review of wear models and equations, along with their use, is done by Meng and Ludema [16]. Wear rates for some CMP materials can be affected by electric fields, and results of the investigation of these effects are given in [17].…”

Section: Introductionmentioning

confidence: 99%