Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints

Zhao, Jin; Ji, Xiao-liang; He, Jin-jiang; Hou, Zhi-chao; Song, Yao; Zhu, Hong-lei; Liu, Bing-rui; Jia, Qiang; Wang, Yi-shu

doi:10.1007/s10853-024-10549-z

J Mater Sci

2024

DOI: 10.1007/s10853-024-10549-z

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Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints

Jin Zhao,

Xiao-liang Ji,

Jin-jiang He

et al.

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Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints

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References 33 publications

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