Effect of electroless copper plating on microstructure, properties and interface of MWCNT-Cu / Ti composites

Fan, Hao; Ouyang, Delai; Chen, Xing; Cui, Xia; Liu, Lintao; Jiang, Jianfei; Ma, Li; Hu, Manying; Tu, Tingting

doi:10.1016/j.jallcom.2024.174487

Journal of Alloys and Compounds

2024

DOI: 10.1016/j.jallcom.2024.174487

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Effect of electroless copper plating on microstructure, properties and interface of MWCNT-Cu / Ti composites

Hao Fan,

Delai Ouyang,

Xing Chen

et al.

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2024

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Cited by 3 publications

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Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Mielewczyk,

Grothe,

Kaskel

et al. 2024

Adv Eng Mater

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A high demand for oxide dispersion strengthened (ODS) materials arose in wide fields of application. The electroless plating method has been presented as an elegant way to overcome different surface energies and obtain metal‐plated ceramics. However, copper electroless plating is still performed under harsh conditions with toxic and expensive reagents, including noble metals and harsh reducing agents like formaldehyde and hydrazine. To create a pure copper metal matrix in an environmentally friendly and efficient way a previously reported method is advanced in a way that naturally occurring amino acids are utilized. A screening of several amino acids leads to an improvement in phase purity and atomic efficiency. Therefore, a Maillard type reaction with lysine as amino compound is reported to show the best results in the particle coating for all ceramic nanoparticles evaluated. The metal plating results in uniform round micro particles showing a homogeneous coating. In order to obtain copper matrix composites, the prepared particles are successfully implemented in a PBF‐LB/M process after mixing with a highly conductive copper alloy. The resulting products were investigated by transmission electron microscopy, scanning electron microscopy, powder X‐ray diffraction, and optical density measurements.

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Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Mielewczyk,

Grothe,

Kaskel

et al. 2024

Adv Eng Mater

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Chemical Surface Metallization for Elastomers with Biphasic Liquid Metals

Gu,

Chen,

Peng

2024

ACS Appl. Polym. Mater.

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Growing interest has been received in lightweight, cost-effective, and easily processable conductive materials with the rapid development of wearable electronics, smart robotics, and bioengineering. Flexible polymer metallization is the most prevalent method to inherit the merits of both metals and elastomers. This work explores and optimizes the metallization process and successfully fabricates a three-layer flexible conductive material through electroless copper plating and gallium electroplating on the surface of elastomers. The material obtained in this work exhibits strong adhesion between the coating layer and soft polymer (peel strength: 1.52 N/mm), considerable stretchability (elongation at break: 507%), high electrical conductivity (3.11 × 10 4 S/m), and outstanding electromechanical stability (2000 cycles). Interestingly, the integration with photolithography enabled selective metallization on specific regions of the elastomer substrate, providing applications in flexible and intelligent devices. This work contributes to the advancement of surface treatment technologies based on the combination of metals and elastomers, which is beneficial for diverse advanced technologies including E-skin, wearable electronics, microelectronics, and nanotechnology.

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Effect of TMAB and ZrC concentration on mechanical and morphological properties of Ni–B/ZrC composite electrodeposition

Hukumdar,

Kumlu,

Keskin

et al. 2024

Materials Testing

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Coating of metal or nonmetallic materials made conductive can be achieved by electrodeposition method. Metals with low conductivity and cost, such as copper or steel, can be coated with materials with higher hardness, corrosion, and wear resistance, such as nickel and boron, and can meet the relevant requirements according to their usage areas. In this study, the impact of trimethylamine borane complex (TMAB) and zirconium carbide (ZrC) contents added to the bath concentrate in the Ni–B/ZrC composite coating applied on copper on the surface properties of electroplating was investigated. Electroplated specimens were examined with regard to mechanical, morphological, and corrosion resistance. The highest microhardness value was obtained in the coatings obtained with 6 g L−1 TMAB and 4 g L−1 ZrC bath concentration, and this value was found to be 1,020.4 H V. When examined in terms of coating morphology, it was seen that as the amount of TMAB increased, the ZrC content decreased over time. In the nanocomposite coating with 4 g L−1 ZrC concentration, which showed the best corrosion performance, the corrosion current decreased by 70 % compared to the Ni–B alloy.

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Effect of electroless copper plating on microstructure, properties and interface of MWCNT-Cu / Ti composites

Cited by 3 publications

References 35 publications

Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

Chemical Surface Metallization for Elastomers with Biphasic Liquid Metals

Effect of TMAB and ZrC concentration on mechanical and morphological properties of Ni–B/ZrC composite electrodeposition

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