Effect of elevated testing temperature on Sn-Ag-Cu interconnect high and low G board level mechanical shock performance

Lee, Tae‐Kyu; Xie, Weidong; Guirguis, Cherif

doi:10.1109/ectc.2015.7159805

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015

DOI: 10.1109/ectc.2015.7159805

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Effect of elevated testing temperature on Sn-Ag-Cu interconnect high and low G board level mechanical shock performance

Tae‐Kyu Lee

Weidong Xie

Cherif Guirguis

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Effect of elevated testing temperature on Sn-Ag-Cu interconnect high and low G board level mechanical shock performance

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References 9 publications

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