Effect of Environmental and Testing Conditions on Board Level Vibration

Roucou, R.; Zaal, J.J.M.; Jalink, J.; Heus, R. De; Rongen, R.T.H.

doi:10.1109/ectc.2016.184

Cited by 14 publications

(23 citation statements)

References 5 publications

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“…Contact-based measurement approach includes a large variety of sensors such as accelerometers [2], strain gauge [20], etc. On the other hand, contactless measurement sensors use optical sensor-based techniques such as LASER Doppler Vibrometer (LDV) [19], Digital Image Correlation (DIC) [21].…”

Section: Vibration Measurement Sensorsmentioning

confidence: 99%

“…In general, accelerometers are utilized to characterize the PCB vibration spectrum during board level vibration tests [2]. Standard piezoelectric accelerometer measurements offer a high measurement range, are cost-effective, and provide easy installation advantages that justify its wide usage.…”

Section: Vibration Measurement Sensorsmentioning

confidence: 99%

“…Presently, several papers, for example [2][3][4][5][6][7] can be found reporting board level vibration test results and PCB dynamic response results. In general, solder joint reliability is in the spotlight, and literature on the methodology and stability of the vibration test method itself is sparse.…”

Section: Introductionmentioning

confidence: 99%

“…In general, solder joint reliability is in the spotlight, and literature on the methodology and stability of the vibration test method itself is sparse. In [2,3], some of the test control settings linked to vibration testing, such as sweep rate and applied stress level are studied.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Thukral

Soestbergen²,

Zaal³

et al. 2022

Microelectronics Reliability

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Section: Vibration Measurement Sensorsmentioning

confidence: 99%

Section: Vibration Measurement Sensorsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Thukral

Soestbergen²,

Zaal³

et al. 2022

Microelectronics Reliability

View full text Add to dashboard Cite

“…The effect of a harsh environment on SMD soldering is also examined (Pocheron et al, 2015). The environmental influence of dynamic response on 1.1 mm PCB is experimentally measured in (Roucou et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Low RH and temperature effect on 0201 sized passive components during SMT mounting

Asghar

Rehman

Aman

et al. 2019

SSMT

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Purpose Low relative humidity (RH) effect surface mount devices in numerous ways. The smaller size (0201) capacitor and resistor start wasting when RH is low. Due to low RH, electrostatic charges built-up on the surface of surface mount devices (SMDs) and component’s reel. The positive charged SMDs stick with the negatively charged reel tape and are wasted. This paper comprehensively explores the environmental effects on 0201 size surface mount devices during mounting process. Different type and size of surface mount devices are tested in low and desired RH to validate the effectiveness of the proposed approach. This paper will also highlight high electrostatic discharge (ESD) due to low RH which can be detrimental for small size surface mount devices. The experimental and graphical illustrations will stipulate the results of success rate for mounting components. The effect on ESD, subsequently varying temperature and humidity will also be analyzed. Design/methodology/approach In this paper, 0201 SDMs will be considered for analysis. The surface mount technology (SMT) plant temperature and humidity has been varied to examine the properties of small size SMDs. Total 5 hours production data are collected from Laptop motherboard production environment. This approach is applicable to all SMT environment. Findings The authors reduced the wastage of 0201 chip size resistor and capacitor. Total 11 components are selected of this size, and there success rate is observed during mounting. These components are first observed in harsh environment where the temperature is first set to 20ºC and RH is set to 25 per cent. The success rate of these components is very low due to component’s wastage. When the plant temperature is set to 25ºC and RH is set to 45 per cent, the success rate of mounting increased up to 100 per cent. A single component placement success rate with respect to RH is observed for one month. The results are shown in Table IV. It can be seen that the success rate is near 100 per cent when RH and temperature is maintained in production environment. To eliminate the ESD build-up in material and equipment in manufacturing environment humidification is a very effective way. When the RH is kept to 45 per cent, the moisture content of the air is a natural conductor and earths any ESD in environment. Originality/value Experimental data have been obtained from Laptop motherboard manufacturing process to validate the effectiveness of proposed approach.

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Monitoring the Response of Electrical Components During Environmental Vibration Tests Using a Scanning Laser Doppler Vibrometer

Heitkamp

Martins

2022

Rotating Machinery, Optical Methods &Amp; Scanning LDV Methods, Volume 6

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Effect of Environmental and Testing Conditions on Board Level Vibration

Cited by 14 publications

References 5 publications

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Low RH and temperature effect on 0201 sized passive components during SMT mounting

Monitoring the Response of Electrical Components During Environmental Vibration Tests Using a Scanning Laser Doppler Vibrometer

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