2021
DOI: 10.1016/j.tafmec.2021.102897
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Effect of environmental conditions on fracture behavior of solder joints

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Cited by 7 publications
(1 citation statement)
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“…Examining the DCB specimens in the first mode of crack propagation and at a strain rate of 0.03 đť‘  , revealed that increasing maintenance temperature and ambient humidity can decline the fracture load by an average of 33% and 15%, respectively. Fracture energy was also reduced because of the mentioned environmental changes significantly [9]. Different manufacturing processes can change the solder joint mechanical behavior by changing the mechanical properties.…”
Section: Introductionmentioning
confidence: 99%
“…Examining the DCB specimens in the first mode of crack propagation and at a strain rate of 0.03 đť‘  , revealed that increasing maintenance temperature and ambient humidity can decline the fracture load by an average of 33% and 15%, respectively. Fracture energy was also reduced because of the mentioned environmental changes significantly [9]. Different manufacturing processes can change the solder joint mechanical behavior by changing the mechanical properties.…”
Section: Introductionmentioning
confidence: 99%