2020
DOI: 10.1016/j.jelechem.2019.113732
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Effect of excess hydrogen bond donors on the electrode-electrolyte interface between choline chloride-ethylene glycol based solvents and copper

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Cited by 2 publications
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“…HBD bonds, choline ion, and water without chloride activate mass transfer during metallic electrodeposition on the surface. As long as the hydration limit of DES is not exceeded (causing the complete dissociation of its components), the HBD, chloride ion, and water bonds oxidize the coated surface, forming oxides preferentially when adding a high concentration of water [21,22]. The weight percentage of water in the CEG-Cu solution used to create all samples in this article was 2 wt%.…”
Section: Electrochemical Characterizationmentioning
confidence: 99%
“…HBD bonds, choline ion, and water without chloride activate mass transfer during metallic electrodeposition on the surface. As long as the hydration limit of DES is not exceeded (causing the complete dissociation of its components), the HBD, chloride ion, and water bonds oxidize the coated surface, forming oxides preferentially when adding a high concentration of water [21,22]. The weight percentage of water in the CEG-Cu solution used to create all samples in this article was 2 wt%.…”
Section: Electrochemical Characterizationmentioning
confidence: 99%