2022
DOI: 10.1108/hff-02-2022-0124
|View full text |Cite
|
Sign up to set email alerts
|

Effect of fluid distribution along the channel length on the cooling performance of microchannel heat sink

Abstract: Purpose The purpose of this study is to conduct research on a new kind of division microchannel heat sink (D-MCHS), which can distribute cooling water along the channel-length direction. First, the pressure drops in the D-MCHS with different division region numbers were compared. Then, the cooling performance of the D-MCHS with different division region numbers was also comparatively investigated. Finally, the temperature distribution on the bottom surface of the D-MCHS was analyzed. Design/methodology/appro… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(2 citation statements)
references
References 39 publications
0
2
0
Order By: Relevance
“…Since then, tremendous work has gone into enhancing microchannel heat sinks' ability to remove the heat created by electronic chips. To maximize the surface available for heat transmission, several microchannel geometries such as circular, rectangular, triangular, and trapezoidal designs (Figure 1) have been used in the creation of microchannel heatsinks (Liu et al, 2022;Zhang et al, 2022). They also employed high-thermal-conductivity materials including copper, aluminum, and silicon to build the microchannel heatsinks (Figure 2) (Japar et al, 2018;Jennings and Smith, 2020;Shamsuddin et al, 2021).…”
Section: Introductionmentioning
confidence: 99%
“…Since then, tremendous work has gone into enhancing microchannel heat sinks' ability to remove the heat created by electronic chips. To maximize the surface available for heat transmission, several microchannel geometries such as circular, rectangular, triangular, and trapezoidal designs (Figure 1) have been used in the creation of microchannel heatsinks (Liu et al, 2022;Zhang et al, 2022). They also employed high-thermal-conductivity materials including copper, aluminum, and silicon to build the microchannel heatsinks (Figure 2) (Japar et al, 2018;Jennings and Smith, 2020;Shamsuddin et al, 2021).…”
Section: Introductionmentioning
confidence: 99%
“…The results indicated a 180% reduction in pressure drop and a 13% increase in Nusselt number with a maximum performance evaluation criterion of 1.76. Zhang et al (2022) proposed a division microchannel heat sink which resulted in a reduced pressure drop due to distributed flow. Chen et al (2020) investigated a multi-parameter structure design of a parallel MCP.…”
Section: Introductionmentioning
confidence: 99%