Effect of free-standing Al/Ni exothermic multilayer film on strength of reactively-soldered Si joints

Morishita, Kana; Kanetsuki, Shunsuke; Goto, Daiki; Kuntani, Yasuhiro; Namazu, Takahiro

doi:10.1299/jsmemecj.2019.j22318p

Cited by 2 publications

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“…To date, we found that the wavy solder-NiAl interface strongly affected bending strength because lots of voids were generated at the interface. 30) Therefore, it is desirable to bond by the solder layer thickness of less than 12 μm. Also, focusing on the approximate curve, it can be expected that cracks possibly become 0% in the region where the bonding width is 100 μm or several tens μm.…”

Section: Resultsmentioning

confidence: 99%

Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Morishita

Ito

Namazu

2020

Jpn. J. Appl. Phys.

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Al/Ni multilayer film shows self-propagating exothermic reaction. By applying a small energy into the film, a NiAl intermetallic compound is formed, and simultaneously the heat generates. We use an Al/Ni exothermic film as a heat source for locally and instantly soldering Si wafers. However, cracking in the reacted NiAl layer is a big problem to be overcome in this reactive bonding technique. In this paper, we try to optimize the bonding condition without generating cracks.

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Section: Resultsmentioning

confidence: 99%

Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Morishita

Ito

Namazu

2020

Jpn. J. Appl. Phys.

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“…[27][28][29][30] The outermost layers on both sides are set to be Ni in consideration of the affinity to SnAg solder. 31) Bilayer thickness is set to range from 15 to 200 nm. As is known that a mixing layer, considered as a diffused layer, exists at the interface between Al and Ni layers with a constant thickness regardless of bilayer thickness.…”

Section: Methodsmentioning

confidence: 99%

Laser-induced multiple points ignition test in Al/Ni exothermic reactive film for crack propagation control

Morishita

Miyake

Namazu

2021

Jpn. J. Appl. Phys.

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Al/Ni multilayer film shows a self-propagating exothermic reaction when a minute external shock is applied. Using the reactive film as a heat source for soldering enables us to complete the bonding process instantaneously within a second because of its fast reaction propagation. However, cracks are introduced in the reacted NiAl layer after bonding, which becomes a big problem in the viewpoint of thermal and mechanical reliability. In this study, a laser-induced multiple points ignition technique is developed, and reaction propagation characteristics and crack introducing phenomenon are investigated toward crack propagation control.

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Effect of free-standing Al/Ni exothermic multilayer film on strength of reactively-soldered Si joints

Cited by 2 publications

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Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Influence of bonded area size on cracking in reacted NiAl layer for crack-free reactive soldering

Laser-induced multiple points ignition test in Al/Ni exothermic reactive film for crack propagation control

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