Effect of Functionalized Binary Silane Coupling Agents by Hydrolysis Reaction Rate on the Adhesion Properties of 2-Layer Flexible Copper Clad Laminate

Electrolytic Chromate Films Prepared via Pulse Electrodeposition as a Cu-Epoxy Adhesion Promoter

“…The bonding between copper and polymer layers is a primary concern for applications in electronics due to its significance effect on both the flexural endurance and long-term reliability. [8][9][10][11][12][13] To date, efforts have focused only on the silane coupling process, 8,11,12,[14][15][16][17][18][19][20] plasma treatment onto polymer substrate, 9,13 and direct formation of metal lines onto an additional glue layer. 10 Among these approaches, the silane coupling method is typically used in industrial applications owing to its low process cost as well as its efficiencies pertaining to mass production.…”

“…The silane, acting as the primary adhesion layer, is polymerized and forms a strong chemical linkage with the dielectric substrate. 19 The chromate film, as the secondary adhesion layer, supports the silane via hydroxyl (-OH-) group, which is essential during the formation of the Si-O bond with silane. Thus, the topology, coverage, and oxidation state of the chromate film significantly affects the population of silane on the Cu surface, and in turn, the adhesion strength.…”