Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders

Liu, Nai Shuo; Lin, Kwang Lung

doi:10.1007/s11085-012-9306-6

Cited by 8 publications

(4 citation statements)

References 9 publications

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“…It can be seen that wetting performance has been improved by Zn and Ga addition and improvements has also been made compared to single alloying element (Zn or Ga) additions in terms of wetting behavior. The effect of Ga on suppressing oxidation and improving wettability has been well documented in Sn-Zn series of solder alloy compositions [7,[17][18][19][20][21][22]. Besides inhibiting oxidation in molten solder, Ga lowers the melting points and improves ductility of solder alloys in Sn-Zn alloys [23].…”

Section: Resultsmentioning

confidence: 99%

“…In addition, alloying Zn into Sn-based solder is concerned, as Zn is very active and may deteriorate wetting performance of lead-free solder at molten state [16]. Ga is also found to be an effective element to improve the wetting performance and suppress the oxidation of molten solder alloys [6,[17][18][19]. But Ga exhibits remarkable solubility in Sn, and the distribution of Ga is unclear.…”

Section: Introductionmentioning

confidence: 99%

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Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Wang

Fang

et al. 2015

J Mater Sci: Mater Electron

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In this study, it is proposed to utilize the advantages of Zn and Ga alloying to achieve improved performance Sn-0.7Cu solder alloys. As dual addition of Ga and Zn into Sn-0.7Cu alloy, wetting force increased while wetting time was reduced simultaneously. Zn promoted the nucleation of b-Sn and lead to the increase of nucleation temperatures. Meanwhile Ga reduced the melting temperature of Sn-0.7Cu. Zn addition introduced another Cu-Zn-Sn intermetallic formation, refined the microstructure. Vickers hardness of Sn-0.7Cu solder alloy and also impact shear strength of Sn-0.7Cu/Ni-Au/Cu solder joints have been obviously improved. The improvements can be attributed to Cu-Zn intermetallic acting as participation phases and solid solution strengthening brought by Ga in b-Sn matrix.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Wang

Fang

et al. 2015

J Mater Sci: Mater Electron

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“…In addition, relatively limited studies addressing their corrosion and oxidation behaviors are available [18][19][20][21]. So in the present work, the microstructure of Sn-8Zn-3Bi was manipulated by changing the solidification rate.…”

Section: Introductionmentioning

confidence: 99%

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

Zhang

Gao

et al. 2016

Metals

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Abstract:The microstructure of Sn-8Zn-3Bi alloy was refined by increasing the solidification rate and the correlation between Zn-rich phase and the corrosion/oxidation behavior of the alloy was investigated. The Zn-rich phase transforms from coarse flakes to fine needles dispersed in the β-Sn matrix with the increase of the cooling rate. The transformation of Zn-rich precipitates enhances the anticorrosive ability of Sn-8Zn-3Bi alloy in 3.5 wt.% NaCl solution. On the contrary, Sn-8Zn-3Bi alloy with a fine needle-like Zn-rich phase shows poor oxidation resistance under air atmosphere, due to the fast diffusion of Zn atoms in Sn matrix.

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“…In view of that, alloying elements such as Bi [9,17], Ag, Cu [18], Ni [4,19,20], and other rare earth elements were selected as alloying additions to the Sn-Zn solder alloy in order to modify the composition. The added trace elements may form strong compounds by reaction with zinc [18], limiting its activity [21], reducing its melting point [10], and forming intermetallic compounds that enhancement the solder's mechanical properties [22]. As continuous development of solder is urgent, necessary, and required in order to generate and innovate more advanced electronic devices, a bridge between reinforcement, enhancement, and the solder matrix should be established.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process

Mohamed,

Mostafa,

Mahmoud

et al. 2023

Phys. Scr.

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The impact of minor additions of nickel and ZrO2 nanoparticles to eutectic Sn-9wt%Zn (SZ) prepared by vacuum melting technique was investigated. The morphologies and microstructures were carried out using an optical microscope (OM) and field emission scanning electron microscope technique (FESEM) escorted by energy dispersive x-ray spectrometry (EDX). The phase structure of the specimens was confirmed by an X-ray diffractometer (XRD). The results obtained demonstrate that small Ni addition causes a major grain refinement of β-Sn, due to the formation of the fine intermetallic compounds Ni5Zn21 and Sn3Ni4Zn3 phases and refines the formation of α- Zn lamellar phase. The melting temperature of the recently discovered solder alloys was lower than that of the eutectic Sn-Zn solders (∆Tm ~ 28 ºC) as a result of the preparation technique and the incorporation of Ni and ZrO2 nanoparticles. The tensile test showed enhanced the mechanical properties of SZ solder as a result of the addition of third elements. The experimental results showed that of all the alloys under investigation, the SZN903 alloy had the greatest UTS and YS values. The enhanced strength of the SZ-ZrO2 alloy defended the results of σUTS and increased the stress exponent parameters, n, by ∼20%. All solders had an activation energy Q that measured between ∼35.62 kJ/mol to ∼58.12 kJ/mol which comparable to the pipe-diffusion mechanism.

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Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders

Cited by 8 publications

References 9 publications

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process

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Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders

Cited by 8 publications

References 9 publications

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Improvement of Ga and Zn alloyed Sn–0.7Cu solder alloys and joints

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

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Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO₂ nanoparticles via vacuum melting process