2018
DOI: 10.1088/1742-6596/1038/1/012080
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Effect of Ga+ focused ion beam etching on photoluminescence of AlGaAs/GaAs heterostructure.

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Cited by 3 publications
(4 citation statements)
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“…Simultaneously, the time-resolved PL measurement reveals that the PL decay rate rises with the increase of ion dose (Figure b), which suggests that more carrier trap defects are formed under higher ion-dose irradiation. As the binding energy of the atoms in the CsPbBr 3 target sample (several electronvolt) is much smaller than the kinetic energy of Ga + ion at 30 keV, the atoms in CsPbBr 3 will be readily displaced from their lattice positions by the elastic core collision resulting from energy and momentum exchanges when the Ga + ion beam is directed onto the target sample. , Moreover, the incident ions after collision and the target atoms knocked free from the lattice sites may still have enough energy to displace more target atoms, which in turn continue to dislocate yet other atoms. , As a result, a “displacement cascade” is formed upon Ga + ion irradiation, which generates plenty of defects including vacancies and interstitials, leading to the PL quenching phenomenon. In general, the penetration depth of the Ga + ion beam lies in the range of several to tens of nanometers, so that the irradiation-induced quenching effects primarily occurs on the surface of the sample .…”
Section: Results and Discussionmentioning
confidence: 99%
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“…Simultaneously, the time-resolved PL measurement reveals that the PL decay rate rises with the increase of ion dose (Figure b), which suggests that more carrier trap defects are formed under higher ion-dose irradiation. As the binding energy of the atoms in the CsPbBr 3 target sample (several electronvolt) is much smaller than the kinetic energy of Ga + ion at 30 keV, the atoms in CsPbBr 3 will be readily displaced from their lattice positions by the elastic core collision resulting from energy and momentum exchanges when the Ga + ion beam is directed onto the target sample. , Moreover, the incident ions after collision and the target atoms knocked free from the lattice sites may still have enough energy to displace more target atoms, which in turn continue to dislocate yet other atoms. , As a result, a “displacement cascade” is formed upon Ga + ion irradiation, which generates plenty of defects including vacancies and interstitials, leading to the PL quenching phenomenon. In general, the penetration depth of the Ga + ion beam lies in the range of several to tens of nanometers, so that the irradiation-induced quenching effects primarily occurs on the surface of the sample .…”
Section: Results and Discussionmentioning
confidence: 99%
“…[14,21] Moreover, the incident ions after collision and the target atoms knocked free from the lattice sites may still have enough energy to displace more target atoms, which in turn continue to dislocate yet other atoms. [14,22] As a result, a "displacement cascade" is formed upon Ga + ion irradiation, which generates plenty of defects including vacancies and interstitials, leading to the PL quenching phenomenon. In general, the penetration depth of the Ga + ion beam lies in the range of several to tens of nanometers, so that the irradiation induced quenching effects primarily occurs on the surface of sample.…”
mentioning
confidence: 99%
“…Etched samples were annealed for 20 min at a temperature of 300 • C. This annealing regime provides an opportunity to remove the amorphized surface layer without recovery of radiation defects [9,10]. Photoluminescence was excited by a semiconductor laser operating at a wavelength of 808 nm with a spot diameter of 80 µm directly in the active GaAs layer of the Al 0.18 Ga 0.82 As/GaAs/Al 0.18 Ga 0.82 As heterostructure.…”
Section: Resultsmentioning
confidence: 99%
“…The electrical contacts from the p-side of the studied microlasers were divided into two sections of different areas using the focused ion beam (FIB). It is well known, that accelerated ions can penetrate deep into the material and, thus, form defects there [27][28][29]. The typical penetration depth is at the level of hundreds of nm, depending on the accelerating voltage and ion type.…”
Section: Methodsmentioning
confidence: 99%