2021
DOI: 10.3390/app11146598
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Effect of Grain Size and Micromorphology of Cu Foil on the Velocity of Flyer of Exploding Foil Detonator

Abstract: In this paper, the effect of grain size and micromorphology of Cu foil on the velocity of the flyer of an exploding foil detonator was studied. A Cu foil with different grain sizes and micromorphologies was prepared by the physical vapor deposition sputtering method. The flyer velocity of the Cu foil was measured by the photon Doppler technique (PDT). The influence of the grain size and micromorphology of the Cu foil (which was the core transducer of the exploding foil detonator) on the flyer velocity and reac… Show more

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Cited by 3 publications
(4 citation statements)
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“…Compared to square bridge foils, arrayed bridge foils have a smaller mass and greater resistance, which better matches the discharge characteristics necessary for efficient ignition. However, precision in manufacturing is critical, as any deviation between the designed and actual array bridge foils can result in synchronization issues during the electrical explosion process [22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%
“…Compared to square bridge foils, arrayed bridge foils have a smaller mass and greater resistance, which better matches the discharge characteristics necessary for efficient ignition. However, precision in manufacturing is critical, as any deviation between the designed and actual array bridge foils can result in synchronization issues during the electrical explosion process [22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%
“…Under the action of the electric field, the insulating gap between the high-voltage electrodes is broken down and turned on, so as to realize the output of short pulse and large current, and complete the conduction and closing function of the high-voltage switch. In 2009, Baginski T A et al [15,16] designed and manufactured a planar dielectric explosion high-voltage switch triggered by Schottky diode and a micro-bridge explosion planar switch with a series structure, and proposed the idea of integrating the switch with EFI. The switch structure is shown in Figure 2.…”
Section: Introductionmentioning
confidence: 99%
“…The switch structure is shown in Figure 2. In 2009, Baginski T A et al [15,16] designed and manufactured a planar dielectric explosion high-voltage switch triggered by Schottky diode and a micro-bridge explosion planar switch with a series structure, and proposed the idea of integrating the switch with EFI. The switch structure is shown in Figure 2.…”
Section: Introductionmentioning
confidence: 99%
“…Traditionally, most of the flyer plates and the accelerating chamber used in EFI are manually pasted and aligned [ 18 ]. The assembly process is complicated, making it difficult to achieve scale production.…”
Section: Introductionmentioning
confidence: 99%