“…In various subtractive manufacturing processes, grinding exhibits dynamic characteristics wherein numerous rigid abrasive particles interact with the work surface, ultimately effecting material removal through the generation of numerous ultra-fine scratches. This process involves the clearance of material by the scraping action of abrasive particles of diverse shapes, sizes, and geometries [12][13]. Three types of abrasive actions, namely friction, plowing, and shearing, occur during the interaction between the grinding wheel and the work surface, collectively influencing the efficiency of the grinding process [14][15].In this case, grinding encounters great challenges when used for silicon nitride ceramic processing [16][17].…”