Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices

Khan, Mohammad Zr; Fatemi, H.; Romero, Jeremias; Delenia, E.

doi:10.1109/relphy.1988.23424

Cited by 17 publications

(1 citation statement)

References 6 publications

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“…This occurs at temperatures between 190°C and 230°C for epoxies and between 260°C and 280°C for silicones. 18,19 Plastic packages can also fail by encapsulant fracture and fatigue at temperatures below this ultimate limit. These mechanisms depend on the stress in the encapsulant which is a function of the coefficient of thermal expansion (CTE) of the encapsulant.…”

Section: Temperature Concerns For First Level Packagingmentioning

confidence: 99%

Packaging Reliability for High Temperature Electronics: A Materials Focus

McCluskey

Condra²,

Torri³

et al. 1996

Microelectronics International

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An overview of the concerns involved in the operation of electronic hardware at elevated temperatures is presented. Materials selection and package design issues are addressed for a wide range of packaging elements from the semiconductor chip to the box. It is found that most elements of common high density device and packaging architecture can be used up to 200°C. However, gold‐aluminium wirebonds, eutectic tin‐lead solder joints and die attaches, and FR‐4 boards will seriously degrade at temperatures below 200°C. For these elements, alternative materials of construction are recommended. Comparisons are made between package design for high power dissipation and that for high temperature operation.

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Section: Temperature Concerns For First Level Packagingmentioning

confidence: 99%

Packaging Reliability for High Temperature Electronics: A Materials Focus

McCluskey

Condra²,

Torri³

et al. 1996

Microelectronics International

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m‐Bromophenolic epoxy resins for electronic packaging

Wang

Lin

Fritz

1992

Angew. Makromol. Chem.

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Meta-halogenated phenols are generally known to be more chemically and thermally stable than their ortho-or para-halogenated counterparts. A reactive intermediate, produced by the bromination of 2,4,6-trimethylphenoI is being used as an alkylating agent to incorporate this stable m-bromophenol moiety into varieties of organic compounds and polymers. In electronic encapsulation applications, epoxy derivatives of novolacs containing m-bromophenol have exhibited superior hydrolytic and thermal stability as compared with the conventional tetrabromo bisphenol-A epoxies which are ortho-brominated phenolics. The m-bromophenol moiety contributes to the extended device reliability while meeting flame retardency requirements as well. ZUSAMMENFASSUNG:Meta-halogenierte Phenole sind bekanntermaoen chemisch und thermisch stabiler als ihre ortho-oder para-halogenierten Analoga. Die Verwendung eines reaktiven Zwischenproduktes, hergestellt durch Bromierung von 2,4,6-Trimethylphenol, als Alkylierungsmittel fur den Einbau der stabilen m-Bromphenol-Einheit in verschiedene organische Substanzen und Polymere wird beschrieben. Bei der Anwendung als Verkapselungsmaterialien fur elektronische Bauteile zeigten sich Epoxid-Derivate von Novolaken mit m-Bromphenol-Einheiten beziiglich hydrolytischer und thermischer Stabilitat den konventionellen Tetrabrombisphenol-A-Epoxidharzen, die ortho-und para-bromiert sind, uberlegen. Die m-Bromphenolgruppe verbessert die Bauteilzuverlassigkeit bei gleichzeitiger Erfullung der Anforderungen an das Brandverhalten.

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