Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I

Moser, Z.; Šebo, P.; Gąsior, W.; Švec, P.; Pstruś, J.

doi:10.1016/j.calphad.2008.10.001

Cited by 25 publications

(19 citation statements)

References 13 publications

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“…Nevertheless, the lower surface tension and cos θ values in Sn-1.0Ag-0.5Cu decrease the wetting force more dominantly [33]; consequently, a lower wetting force value is obtained. Among the Sn-Ag-Cu-In and Sn-3.0Ag-0.5Cu alloys, the lower density of Sn-Ag-Cu-In is estimated to increase the wetting force, whereas the slightly lower surface tension of Sn-Ag-Cu-In alloys may minutely cause a decrease in the wetting force [27,33]. However, the lower final wetting angle measured in Sn-Ag-Cu-In effectively serves to increase the wetting force [27].…”

Section: Resultsmentioning

confidence: 98%

“…However, the times to buoyancy (corrected to a zero value i.e., the zero crossover times) showed a decrease, and the wettability with respect to the soldering temperature was not evaluated. Moreover, earlier research has shown that an addition of indium (In) is very effective for enhancing the zero crossover time as well as the wetting angle and the wetting force [26,27]. However, the amount added should be minimized in an effort to diminish the raw material cost while maintaining the wettability.…”

Section: Introductionmentioning

confidence: 98%

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Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

Kim

Lee

et al. 2011

Met. Mater. Int.

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Through the use of a wetting balance technique, the wetting characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys with respect to the In content and soldering temperature were investigated to validate the applicability of compositions with a low Ag content as solder material. It was found that a small addition (0.4-0.6 wt.%) of In significantly improved the wetting properties of the Sn-1.2Ag-0.5Cu-xIn composition at soldering temperatures ranging from 230°C to 240°C due to the excellent wetting property of In. In an observation of the interfacial reaction, it was found that the added In element did not participate in the interfacial reaction with a Cu or Ni pad, unlike in the Sn-Ag-Cu-In case, which has a high In content. The package or boardside IMC layers in Sn-1.2Ag-0.5Cu-0.4In joints were thinner than those of Sn-3.0Ag-0.5Cu, especially after aging.

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Section: Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 98%

Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

Kim

Lee

et al. 2011

Met. Mater. Int.

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“…Initially, the research for the physical properties was focused on binary systems (Pb-Sn [1,2] and Ag-Sn [3]), and then, it was expanded to multicomponent systems on the base of the AgSn eutectic, including also wettability and microstructural studies [4,5]. The studies were also carried out in the frames of the programs COST 531 (low-temperature solders) [6,7] and COST MP 0602 (high temperature solders) [8], as well as projects financed by the Polish Government and in the cooperation with Tohoku University and industrial Institutes [9].…”

Section: Introductionmentioning

confidence: 99%

Influence of Zinc on the Surface Tension, Density and Molar Volume of (Ag-Sn)eut +Zn Liquid Alloys

Gąsior¹,

Pstruś²,

Moser³

2016

Archives of Metallurgy and Materials

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The dilatometric and maximum bubble pressure methods were applied for the measurements of the density and surface tension of liquid (Ag-Sn)eut+Zn lead-free solders. The experiments were carried out in the temperature range from 515 to 1223 K for the alloys of the zinc concentration equaling 0.01, 0.02, 0.04, 0.05, 0.1 and 0.2 of the mole fraction. It was found that the temperature dependence of both the density and the surface tension could be thought as linear, so they were interpreted by straight line equations. The experimental data of the molar volume of the investigated alloys were described by the polynomial dependent on the composition and temperature.Calculations of the surface tension by Butler’s equation were conducted and confronted with the experimental data. Some significant deviations between the experimental and the calculated surface tension were observed. They reached almost 40 mNm-1. The observed changes of the density and surface tension caused by the zinc addition to the Ag-Sn eutectic were discussed with the consideration of the thermodynamic properties and the influence of a small quantity of impurities in a protective gas atmosphere.

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“…The mechanical, chemical, physical and electrical properties and interfacial reactions were studied by many researchers, but Sn-Ag-Cu system is a base for many alloys of practical importance. 1 Especially, Sn-based alloys, including Sn-Ag and Sn-Cu eutectics, are used as low-temperature Pb-free solders in electronic industry. 2 Both the surface tension and density are important parameters of soldering processes.…”

Section: Introductionmentioning

confidence: 99%

“…For these reasons a large number of Pb-free solder alloys have been proposed. 1 Binary, ternary and quaternary systems have been studied in order to know their characteristics as solder materials. Many of these systems are Sn-based alloys with other constituents such as Cu, In, Bi, Au, Ag, Sb and Mg.…”

Section: Introductionmentioning

confidence: 99%

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

M’chaar

Sabbar

Moudane

et al. 2017

J. Theor. Comput. Chem.

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Some physicochemical properties such as surface tension, molar volume, density and viscosity of liquid Sn-Ag-Cu alloys have been calculated using Kohler, Muggianu, Toop and Hillert geometrical models along three cross-sections namely x Ag /x Cu ¼ 1=2, 1/1 and 2/1. Indeed, Guggenheim, Kozlov-Romanov-Petrov and Kaptay equations have also been extended to estimate the surface tension and viscosity based on the thermodynamic data of the investigated system over wide temperature ranges of 823-1123 K and 773-1173 K, respectively. The results show that the three investigated properties, surface tension, density and viscosity, decrease with increasing tin for all studied models. On the other hand, a di®erent behavior of these properties as a function of the temperature was noted. This evolution depends on the composition of the studied alloys.On the contrary, the molar volume increases with increase of temperature and tin compositions. It should be noted that the surface tension, density and molar volume show a linear dependence on temperature for all the investigated compositions. For viscosity, a curvilinear dependence has been observed. The calculated surface tensions and densities were compared with those reported experimentally for Sn-Ag-Cu alloys along the cross-section x Ag /x Cu ¼ 1/1.

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Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I

Cited by 25 publications

References 13 publications

Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

Influence of Zinc on the Surface Tension, Density and Molar Volume of (Ag-Sn)eut +Zn Liquid Alloys

Theoretical investigation of some physicochemical properties in the liquid Sn–Ag–Cu alloys

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