Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints

Chen, Zhong; He, Min; Kumar, Aditya; Qi, Guo-Jun

doi:10.1007/s11664-006-0008-1

Cited by 26 publications

(8 citation statements)

References 28 publications

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“…For tensile test of solder joint, bulk solder failure was the dominant failure mechanism for as-joined samples. Interface failure only occurred after extended reflow or aging treatment [2][3][4]. However in the current work, interface failure mechanisms dominated for all cases.…”

Section: Fractographic Analysismentioning

confidence: 51%

“…It is well studied that interface reaction may cause defect accumulation, giving rise to the weakening of the interface [2][3][4][5]. The increase in reflow / aging duration also significantly increases the IMC thickness.…”

Section: Source Of the Fracture Energy And Its Degradationmentioning

confidence: 99%

“…Bulk solders have been used for tensile test in dog bone configuration [1] in order to extract properties like yield strength, modulus from stress-strain curve, creep behaviour, etc. However, the properties of bulk solder specimens may not reflect the solder joint reliability in the actual devices as it is well known that thermal treatment and electromigration will cause the interface to be relatively weak than the bulk solder [2][3][4]. This is due to the extensive interface diffusion and the corresponding defect generation, typically indicated by the growth of intermetallic compound (IMC) at the interface [5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

“…Another popular technique widely used is ball shear test [14][15][16], which can also be used to determine the bond strength between the solder ball and the substrate. Tensile tests of solder joints are also adopted to study the interfacial failures in the microstructures and the effect of reflow, ageing and surface finishes [2][3][4][17][18][19]. Solder joint in the form of arrays or designed geometry could be employed to measure the joint strength.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Interface Fracture Toughness Assessment of Solder Joints Using Double Cantilever Beam Test

Loo

Lee

Lim

et al. 2010

Int. J. Mod. Phys. B

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In the current work, a test scheme to evaluate solder joint interface fracture toughness using double cantilever beam (DCB) test has been successfully demonstrated. The obtained results, in terms of critical energy release rate, predict the joint failure based on the principle of fracture mechanics. The results can be used as a materials property in the reliability design of various types of solder-ball joined packages. DCB specimens made of 99.9 wt% copper were selected in the current work. Eutectic Sn-37Pb and lead-free Sn-3.5Ag-0.5Cu solders were used to join two pieces of the copper beams with controlled solder thickness. The test record showed steady propagation of the crack along the solder / copper interface, which verifies the viability of such a testing scheme. Interface fracture toughness for as-joined, extensively-reflowed and thermally aged samples has been measured. Both the reflow treatment and the thermal aging lead to degradation of the solder joint fracture resistance. Reflow treatment was more damaging as it induces much faster interface reaction. Fractographic analysis established that the fracture has a mixed micromechanism of dimple and cleavage. The dimples are formed as a result of the separation between the hard intermetallic compound (IMC) particles and the soft solder material, while the cleavage is formed by the brittle split of the IMCs. When the IMC thickness is increased due to extended interface reaction, the proportion of IMC cleavage failure increases, and this was reflected in the decrease of the critical energy release rate.

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Section: Fractographic Analysismentioning

confidence: 51%

Section: Source Of the Fracture Energy And Its Degradationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Interface Fracture Toughness Assessment of Solder Joints Using Double Cantilever Beam Test

Loo

Lee

Lim

et al. 2010

Int. J. Mod. Phys. B

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show abstract

“…Indeed there is plenty of evidence for interface strength degradation with either extended aging or reflow. [20][21][22][23][24][25][26] The interface reaction was found to smoothen the interface and/or generate interface voids, causing the degradation. The passage of electric current is likely to aid interdiffusion during the interface reaction, expediting the degradation process.…”

Section: Effect Of Electromigration On the Mechanical Properties Of Smentioning

confidence: 99%

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Kumar

Yang

Wong

et al. 2008

Journal of Elec Materi

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The effect of moderate electric current density (1 9 10 3 to 3 9 10 3 A/cm 2 ) on the mechanical properties of Ni-P/Sn-3.5Ag/Ni-P and Ni/Sn-3.5Ag/Ni solder joints was investigated using a microtensile test. Thermal aging was carried out at 160°C for 100 h while the current was passed. The interfacial microstructure and intermetallic compound (IMC) growth were analyzed. It was found that, at these levels of current density, there were no observable voids or hillocks. Samples aged at 160°C without current stressing failed mostly inside the bulk solder with significant prior plastic deformation. The passage of current was found to cause brittle failure of the solder joints and this tendency for brittle failure increased with increasing current density. Fractographic analysis showed that, in most of the electrically stressed samples, fracture occurred at the interface region between the solder and the joining metals. The critical current density that caused brittle fracture was about 2 9 10 3 A/cm 2 . Once brittle fracture occurred, the tensile toughness, defined as the energy per unit fractured area, was usually lower than $5 kJ/m 2 , compared with the case of ductile fracture where this value was typically greater than $9 kJ/m 2 . When comparing the two types of joint, the brittle failure was found to be more severe with the Ni than with the Ni-P joint. This work also found that the passage of electric current affects the IMC growth rate more significantly in the Ni than in the Ni-P joint. In the case of the Ni joint, the Ni 3 Sn 4 IMC at the anode side was appreciably thicker than that formed at the cathode side. However, in the case of electroless Ni-P metallization, this difference was much smaller.

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Tensile properties of Cu/Sn–58Bi/Cu soldered joints subjected to isothermal aging

et al. 2014

J Mater Sci: Mater Electron

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Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints

Cited by 26 publications

References 28 publications

Interface Fracture Toughness Assessment of Solder Joints Using Double Cantilever Beam Test

Interface Fracture Toughness Assessment of Solder Joints Using Double Cantilever Beam Test

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Tensile properties of Cu/Sn–58Bi/Cu soldered joints subjected to isothermal aging

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