2013
DOI: 10.1016/j.actamat.2013.01.003
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Effect of internal stress on the hydriding kinetics of nanocrystalline Pd thin films

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Cited by 16 publications
(19 citation statements)
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“…While the absolute stress values differ, the trend of the stress evolution upon film growth can be transferred to that of films with similar micro-structure. Different absolute stresses we ascribe to the different sputter gas pressures and different kinetic energies of the atoms acting in the atom peening, see chapter 5.1.1 [4,38].…”
Section: Intrinsic Stress Of Sputtered Palladium Thin Filmsmentioning
confidence: 99%
“…While the absolute stress values differ, the trend of the stress evolution upon film growth can be transferred to that of films with similar micro-structure. Different absolute stresses we ascribe to the different sputter gas pressures and different kinetic energies of the atoms acting in the atom peening, see chapter 5.1.1 [4,38].…”
Section: Intrinsic Stress Of Sputtered Palladium Thin Filmsmentioning
confidence: 99%
“…Soon after the start of Pd deposition, the slope of the stress*thickness vs. thickness curve becomes constant. As detailed previously, the sign and magnitude of this slope were both observed to be a function of p Ar [28]. Consequently, one can tune the mean internal stress in the deposit (s o ) by varying p Ar , as illustrated in Fig.…”
Section: Introductionmentioning
confidence: 85%
“…Cantilever specimens with dimensions 3 Â 0.5 cm 2 were then cut from these wafers for the annealing and hydriding experiments. DC magnetron sputtering has been used to deposit the Ti and Pd films, with real-time monitoring of the specimen curvature as detailed in a previous publication [28]. The deposition parameters have been adjusted in order to generate columnar grains with a high concentration of crystalline defects [41].…”
Section: Experimental Methodsmentioning
confidence: 99%
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