2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00031
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Effect of Lamination Process-Induced Residual stress on the CTE of Advanced Prepregs Before and After Solder Reflow Process

Byoung-Phil Kang,
Jong-Yun Lee,
Jaesung Kim
et al.
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