Effect of Manufacturing Conditions on the Anisotropic Dimensional Change of STD11 Tool Steel during Heat Treatment

Hong, Ki-Jung; Song, Jin-Hwa; Chung, In-Sang

doi:10.3365/kjmm.2012.50.1.013

Korean J. Met.Mater.

2012

DOI: 10.3365/kjmm.2012.50.1.013

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Effect of Manufacturing Conditions on the Anisotropic Dimensional Change of STD11 Tool Steel during Heat Treatment

Ki-Jung Hong¹,

Jin-Hwa Song²,

In-Sang Chung³

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Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Park¹,

Kim²,

Park³

2014

Jpn. J. Appl. Phys.

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Effects of both wet chemical treatments and line pattern densities on the interfacial bonding characteristics of Cu–Cu pattern direct bonds were systematically investigated. The silicon oxide (SiO2) on a parallel Cu lines patterned wafer could be removed effectively by using a solution of buffered oxide etch and sulfuric acid (BOE/H2SO4) to improve the bonding quality of Cu–Cu pattern direct bonds. The Cu surface after BOE/H2SO4 wet pretreatment revealed the complete removal of both the residue particles and the surface oxide layer. After BOE/H2SO4 wet pretreatment, the interfacial adhesion energies of 0.06, 0.09, and 0.23 pattern densities were 7.9, 4.8, and 4.1 J/m2, respectively, where the dielectric erosion due to chemical–mechanical polishing (CMP) process with increasing pattern density significantly affected the Cu–Cu pattern direct bonding quality. Therefore, CMP planarization performance is critical for reliable Cu pattern direct bonding.

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Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Park¹,

Kim²,

Park³

2014

Jpn. J. Appl. Phys.

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Effects of post-annealing and temperature/humidity treatments on the interfacial adhesion energy of the Cu/SiN_x interface for Cu interconnects

Jeong

Bae

Lee

et al. 2016

Jpn. J. Appl. Phys.

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The effects of 200 °C post-annealing and 85 °C and 85% relative humidity temperature and humidity (T/H) treatments on the interfacial adhesion energy of a Cu/SiN x interface were systematically investigated. The results of a four-point bending test, X-ray photoemission spectroscopy, and high-resolution transmission electron microscopy revealed that the interfacial adhesion energy during T/H treatment decreased with time faster than during annealing treatment, which is closely related to the faster Cu oxidation of SiN x /Cu interfaces.

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Effect of Manufacturing Conditions on the Anisotropic Dimensional Change of STD11 Tool Steel during Heat Treatment

Cited by 2 publications

References 0 publications

Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Effects of post-annealing and temperature/humidity treatments on the interfacial adhesion energy of the Cu/SiN_x interface for Cu interconnects

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Effect of Manufacturing Conditions on the Anisotropic Dimensional Change of STD11 Tool Steel during Heat Treatment

Cited by 2 publications

References 0 publications

Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Effects of wet treatment conditions and pattern densities on interfacial bonding characteristics of Cu–Cu direct bonds

Effects of post-annealing and temperature/humidity treatments on the interfacial adhesion energy of the Cu/SiNx interface for Cu interconnects

Contact Info

Product

Resources

About

Effects of post-annealing and temperature/humidity treatments on the interfacial adhesion energy of the Cu/SiN_x interface for Cu interconnects