Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

Li, Yan; Kang, Renke; Gao, Hang; Wu, Dongjiang

doi:10.1080/15394450902996643

Cited by 7 publications

(3 citation statements)

References 17 publications

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“…Active NoCE of 0 means circular symmetry, and hence the conical and spherical tips are commonly used for exploring the effect of crystal anisotropy on the values of critical load/depth of DBT and the friction coefficient [153][154][155]. Several representative experimental studies are listed in table 3.…”

Section: Grit Shape and Orientationmentioning

confidence: 99%

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

Huang

Yan

2023

Int. J. Extrem. Manuf.

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Brittle materials are widely used for producing important components in the industry of optics, optoelectronics, and semiconductors. Ultraprecision machining of brittle materials with high surface quality and surface integrity helps improve the functional performance and lifespan of the components. According to their hardness, brittle materials can be roughly divided into hard-brittle and soft-brittle ones. Although there have been some literature reviews for ultraprecision machining of hard-brittle materials, up to date, very few review papers are available that focus on the processing of soft-brittle materials. Due to the “soft” and “brittle” properties, this group of materials has unique machining characteristics. This paper presents a comprehensive overview of recent advances in ultraprecision machining of soft-brittle materials. Critical aspects of machining mechanisms such as chip formation, surface topography, and subsurface damage for different machining methods, including diamond turning, micro end milling, ultraprecision grinding, and micro/nano burnishing, are compared in terms of tool-workpiece interaction. The effects of tool geometries on the machining characteristics of soft-brittle materials are systematically analyzed, and dominating factors are sorted out. Problems and challenges in the engineering applications are pointed out, and solutions/guidelines for future R&D are provided.

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Section: Grit Shape and Orientationmentioning

confidence: 99%

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

Huang

Yan

2023

Int. J. Extrem. Manuf.

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“…Currently, researchers have more and more interests on HgCdTe crystal, and great strides have been achieved in the past few years [6,7]. However, due to its soft-brittle nature, the machining of HgCdTe wafers is a challenge in the field of ultraprecision manufacture, the manufacturing of others soft materials have been reported, such as CdZnTe [8][9][10]. Because the chemical polishing process is very complex and is affected by the polishing slurry, polish recipes, and the property of wafers, we cannot straightly use these processes to polish HgCdTe wafers; the polish process of HgCdTe wafers is rarely reported.…”

Section: Introductionmentioning

confidence: 99%

A New High-Efficiency and Low-Damage Polishing Process of HgCdTe Wafer

Wang

Gao

et al. 2012

Materials and Manufacturing Processes

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HgCdTe crystals have been accepted as a very important material of infrared detectors, and due to their soft-brittle nature, machining HgCdTe wafers is a challenge in the field of ultraprecision manufacture. In this article, the new polishing slurry is developed, and the new polishing process is employed to polish HgCdTe wafers; the polishing results showed that the polished surface roughness Ra is as small as 0.32 nm, the polished surface is smooth and flat, and the subsurface damage only contains thin amorphous layer with depth of 3 nm. The material removal mechanism during polishing HgCdTe wafers is that HgCdTe react with oxidant and acid in the polishing slurry, and at last, the polished surfaces are covered with HgCdTe and TeO 2.

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“…7 [38]) found that plastic deformation was small and the scratches were subtle on the wafer surface ground with a #5000 grinding wheel. Li et al [39] investigated the effect of mechanical anisotropy on grinding of CZT (110) and (111) planes. They found that the optimum grinding directions are h110i directions on the (110) plane and h112i directions on the (111) plane.…”

Section: Ultra-precision Grindingmentioning

confidence: 99%

Research progress on ultra-precision machining technologies for soft-brittle crystal materials

et al. 2017

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Soft-brittle crystal materials are widely used in many fields, especially optics and microelectronics. However, these materials are difficult to machine through traditional machining methods because of their brittle, soft, and anisotropic nature. In this article, the characteristics and machining difficulties of soft-brittle and crystals are presented. Moreover, the latest research progress of novel machining technologies and their applications for softbrittle crystals are introduced by using some representative materials (e.g., potassium dihydrogen phosphate (KDP), cadmium zinc telluride (CZT)) as examples. This article reviews the research progress of soft-brittle crystals processing.

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Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

Cited by 7 publications

References 17 publications

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review

A New High-Efficiency and Low-Damage Polishing Process of HgCdTe Wafer

Research progress on ultra-precision machining technologies for soft-brittle crystal materials

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