Effect of mechanical attrition on microstructure and property of electroplating of copper plating in acid solution

Abstract

Abstract. In this paper, the mechanical attrition(MA) was supplied in a traditional electroplating process by rolling movement of different diameter of glass balls in the acid copper plating electrolyte to study the effects of different diameters of the glass balls on microstructure of copper plating and the properties of carbon-impervious, grain refine and corrosion resistance. The results showed that the grain size of the plating had obviously decreased in the MA process, and with increasing the diameters of the glass balls, the porosity, corrosion resistance and the properties of carbon-impervious of the plating were first increased and then decreased.