Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

Zhang, Wanru; He, Liang; Wang, Ting; Liu, Xiaobo; Tong, Lifen

doi:10.1002/app.53947

Cited by 5 publications

(3 citation statements)

References 40 publications

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“…The slightly decreased dielectric constant with the increased frequency can be assigned to the interfacial relaxation, called the Maxwell–Wagner (M–W) relaxation, which is associated with the difference in electron entrapment by the ZIF-8(Zn–Co) NPs and ER (Figure a). The corresponding calculated frequency factors are 0.0826, 0.0991, and 0.1021, indicating a slight decrease of the frequency stability (eq S3). The dielectric loss curves of the ECs with different additive amounts of ZIF-8(Zn–Co) NPs all display two peaks around 255 Hz and 100 kHz, which can be assigned to the interfacial and dipole polarization, respectively .…”

Section: Resultsmentioning

confidence: 99%

Silver-Loaded Zeolitic Imidazolate Frameworks as Resin-Compatible Nanofillers for Embedded Capacitors with Improved Thermal and Electrical Performances

Wang,

Sun,

Zhang

et al. 2024

ACS Appl. Nano Mater.

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The application of embedded capacitors (ECs) has been a promising solution to the miniaturization and multifunctionalization of electronic devices. However, ECs still face challenges in the improvement of their dielectric properties. Here we report the fabrication of ECs by using silver-loaded zeolitic imidazolate frameworks [Ag@ZIF-8(Zn− Co)] as nanofillers for epoxy resin (ER). Dispersants are not required due to the compatibility between the Ag@ZIF-8(Zn−Co) nanoparticles (NPs) and ER. The fabricated ECs show increased glass transition temperatures (T g ) and thermal conductivities. The reduction of Ag + ions inside the ZIF-8(Zn−Co) pores can create Schottky barriers with lowered band gaps and provide steric hindrances for the Ag NPs. Increased electrical conductivities and reduced conductive pathways can be achieved. The fabricated ECs show improved dielectric constants while restricting dielectric losses. The application of coordination polymer nanofillers with conductive metal NPs inside the pores can afford avenues toward advanced ECs.

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Section: Resultsmentioning

confidence: 99%

Silver-Loaded Zeolitic Imidazolate Frameworks as Resin-Compatible Nanofillers for Embedded Capacitors with Improved Thermal and Electrical Performances

Wang,

Sun,

Zhang

et al. 2024

ACS Appl. Nano Mater.

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“…Flexible copper clad laminates (FCCL) based on copper conductors and electrical insulating polymer substrates have witnessed the rapid progress of electronic industries for more than half a century 1–3 . The most commonly used polymer insulating substrates are polyimide (PI) films, which are characterized by the excellent thermal, mechanical and electrical properties 4–6 .…”

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

Han,

Qi,

Zhi

et al. 2024

Polymers for Advanced Techs

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A series of ester‐ and fluoro‐containing thermoplastic polyimide (PI) films, PEsI‐1 ~ PEsI‐4 have been prepared by the two‐step thermal imidization procedure via the soluble poly(amic acid) (PEsAA) precursors from the copolymerization of four monomers, including the dianhydrides of bisphenol A dibenzoate‐3,3′,4,4′‐tetracarboxylic acid dianhydride (TMBPA) and 3,3′, 4,4′‐biphenyl tetracarboxylic acid dianhydride (BPDA) and the diamine monomers of 4‐aminophenyl‐4′‐ aminobenzoate (APAB) and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFMB) in the polar aprotic solvent of N‐methyl‐2‐pyrrolidinone (NMP). The PI films obtained from the high‐temperature dehydration of the PEsAA solutions exhibited the good thermal stabilities with the glass transition temperatures (Tg) over 269°C, the 5% weight loss temperatures (T5%) higher than 480°C, and the linear coefficients of thermal expansion (CTE) values in the range of 17.7 × 10−6/K–33.6 × 10−6/K in the temperature range of 50–250°C. Meanwhile, the PI films showed good thermoplasticity in the dynamic mechanical analysis (DMA) tests, in which the storage modulus of the PI films dropped sharply in the temperature range of glass transition of the polymers. At last, the PI films exhibited the good dielectric properties with the breakdown voltages (Vb) over 5200 V, the dielectric strength (Ds) higher than 210 V/μm, the dielectric constants (Dk) in the range of 3.26 ~ 3.32 at the frequency of 10 GHz, and the dielectric dissipation factors (Df) of 0.0038 ~ 0.0047. Compared with the commonly used PEsI‐ref film for high‐frequency flexible copper clad laminates (FCCL), the currently developed PI films exhibited the obviously increased Tg values, decreased CTE values, and comparable dielectric properties.

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“…Polyarylene ether nitriles (PENs) are a kind of super engineering materials with high‐temperature resistance, great electrical insulation, adjustable dielectric constant, and excellent mechanicals. These advantages enable the polymer to be applied in many fields, such as polymer‐insulating substrates used in flexible printed circuit boards, 31 interlayer dielectric materials, 32–36 Li‐battery separators, 37,38 and corrosion fields 39 . However, the low intrinsic TC and high thermal expansion coefficient of PENs seriously affect their applications in cutting‐edge electronic fields.…”

Section: Introductionmentioning

confidence: 99%

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

He,

Zhang,

Liu

et al. 2023

Polymer Composites

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Thermal conductive polymer‐based composites synchronously with stable dielectric and excellent mechanical properties are urgently needed for high‐temperature‐resistant electronic devices. Here, a significant improvement in the thermal conductivity (TC), thermal stability, dielectric, and mechanical performance was simultaneously achieved in the polyarylene ether nitrile (PEN)/divinyl siloxane‐bisbenzocyclobutene (BCB) matrix through the incorporation of boron nitride nanosheets (BNNS) combined together with the post‐solid phase chemical reaction technique. The significant increase in the effective filler‐filler and filler‐crystal contacts in the composites was the main reason for the improvement in TC and dielectric constant. Besides, glass transition temperature (Tg) and mechanicals were enhanced in the presence of cross‐linked networks. By synchronously adding 15 vol% BNNS, the TC of composites after treatment reached up to 5.582 W/m.K, enhanced by 4.4 times higher than untreated. The dielectric constant was down to 2.93 at 1 MHz and the loss remained at a relatively low level. Meanwhile, the composite showed significantly enhanced thermal stability, mechanicals, and hydrophobicity (Tg = 336°C, T5% = 529°C, tensile strength and modulus was 94.5 MPa and 5.3 GPa, respectively, the contact angle was 101.76°). Thus, it promotes an effective strategy for fabricating a high‐performance‐polymer composite, which has the potential used in electronic materials.Highlights Crystallization‐crosslinking strategy optimizes overall performance. Crystals fill gaps between BNNS layers and connect thermal conductive pathway. Crosslinked networks limit molecular chain motion to reduce phonon scattering. The highest TC of the PEN/BCB/BNNS composite is up to 7.451 W/m.K. Thermal property shows significant improvement after crosslinking especially Tg.

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Effect of molecular weight on properties of polyarylene ether nitrile‐based flexible copper clad laminate

Cited by 5 publications

References 40 publications

Silver-Loaded Zeolitic Imidazolate Frameworks as Resin-Compatible Nanofillers for Embedded Capacitors with Improved Thermal and Electrical Performances

Silver-Loaded Zeolitic Imidazolate Frameworks as Resin-Compatible Nanofillers for Embedded Capacitors with Improved Thermal and Electrical Performances

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction

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