Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

“…Metal matrix alloying [10,[12][13][14][15][16][17][18] or diamond surface coating [6,[19][20][21][22][23][24][25] with a carbide-forming element is generally utilized to solve the problem through the formation of an interlayer between Cu and diamond. In literature, the carbide-forming elements of Ti [11,25], W [6,19], Mo [26,27], Cr [7,28], Si [21,28] and B [20] have been reported to enhance the thermal conductivity of Cu/diamond composites. Although a level of 600-700 W/mK has been attained for the Cu/diamond composites [6,12,18,29], the values still leave much room from the thermal conductivity theoretically predicted for the composites.…”

On the thermal conductivity of Cu–Zr/diamond composites

“…In particular, diamond reinforced copper matrix (Cu/Dia) composites receive the most attention and have been considered to be a next generation of thermal management material for electronic packages and heat sinks applications. High thermal conductivity of 300-900 W/m K for Cu/Dia composites, by incorporation of 40-90 vol.% diamond particles can be obtained by several fabrication routes namely high temperature high pressure (HPHT) [13,14], pressure-assisted or pressureless infiltrations [15,16], pulse plasma sintering (PPS) [17,18] and spark plasma sintering (SPS) [19,20].…”

“…Nevertheless, the fabrication process of coating method always involves complicated processing steps, including suspending diamonds in a solvent by means of particle surface functionalization, mixing metal ions with the diamonds suspension, drying, calcinations, and reduction, the costs are therefore usually high. A few studies employ melting and solidification route, such as pressure-assisted infiltration by using bulk copper alloy for preparing Cu/Dia composites [15,16]. However, the requirement of high temperature leads to the production of defect sites within the diamond structure (graphitization or oxidation), causing a significant decrease in the inherent thermal conductivity of diamonds.…”

Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites

“…Several authors have recently investigated the effect of TR in Cu/D and Al/D composites [18,20,21,34,42,48] through experimental and numerical means. Researchers [1,2,7,32,38,45,47] have also reported improved thermal conductivity in Cu/D composites by using Ti, Cr, Mo, and W coated diamond particles.…”