Effect of nano- and micro-particle additions on moisture absorption in thixotropic room temperature cure epoxy-based adhesives for bonded-in timber connections

Ahmad, Zakiah; Ansell, Martin P.; Smedley, D.

doi:10.1016/j.ijadhadh.2010.04.001

Cited by 47 publications

(24 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The beech wood had a higher strength than the poplar wood (Osmannezhad et al 2014). Ahmad et al (2010) investigated the fracture toughness of three room-temperature cured epoxy adhesives formulated for in situ timber bonding. Commercial Timberset TM wood was used and cured with VESTAMIN ® TMD, which is mainly composed of trimethyl hexamethylene diamine.…”

Section: Introductionmentioning

confidence: 99%

“…It was found that, under a high impact rate, the toughness was ductile in the unnotched wood and brittle in the notched wood. Therefore, the toughness of the thixotropic adhesives could be enhanced by the inclusion of phase separated liquid rubber in the epoxy matrix (Ahmad et al 2010). The FRP-wood composite bonded using the epoxy adhesive was manufactured by Raftery et al (2009).…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Designing the Epoxy Adhesive Formulations for Manufacturing Engineered Woods

Meekum¹,

Wongkheeree²

2017

BioResources

View full text Add to dashboard Cite

The design of an epoxy adhesive was investigated by a 2 K design of experiment (DOE). All the assigned parameters showed no significant effect for both curing and mechanical properties, except for bisphenol A (BPA), which showed a significantly negative effect on the heat distortion temperature (HDT) of the cured samples. Adding dicyandiamine (DICY) into the hardener retarded cure time and also caused an incomplete curing at room temperature. Curing at 110 °C and 150 °C post curing were the optimal conditions and 20 g of DICY with 50 g of triethylenetetramine (TETA) was optimized. Adduct obtained from aliphatic epoxy (RD108, 14.63 g) and TETA (7.71 g) were selected and employed as hardener ingredients. The incomplete crosslinking reaction was the main reason for the inferior properties at high RD108 loadings. The toughening by blending with polycarbonate (PC) was explored, and 5 phr of PC was selected. Limitation of resin/fiber infusion due to high viscosity was observed. Dilution of the solvents using ethyl acetate (EA) and methyl ethyl ketone (MEK) to reduce viscosity was explored. The mechanical properties of the wood samples manufactured from the EAdiluted epoxy were superior to the MEK dilution. The lower boiling point and good solubility of EA were explained.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Designing the Epoxy Adhesive Formulations for Manufacturing Engineered Woods

Meekum¹,

Wongkheeree²

2017

BioResources

View full text Add to dashboard Cite

show abstract

“…Facilities in tropical locations need special consideration for the effect of heat and high humidity [6]. An epoxy adhesive is susceptible to moisture attack because it has hydrophilic groups that attract water molecules [10,11,6]. Moisture absorbed into adhesives can act as a plasticizer, solvent or hydrolysis agent [12].…”

Section: Introductionmentioning

confidence: 99%

Comparison between composite and metallic patches for repairing aircraft structures of aluminum alloy 7075 T6

Benyahia

Albedah

Bouiadjra

et al. 2015

International Journal of Fatigue

View full text Add to dashboard Cite

“…An epoxy adhesive is susceptible to moisture attack because it contains hydrophilic chemicals that attract water molecules [18][19]. Moisture absorbed into adhesives can act as a plasticizer, solvent or hydrolysis agent [20]. Some effects, such as plasticization and swelling, are reversible.…”

Section: Introductionmentioning

confidence: 99%