Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Gao, He; Liu, Wei; An, Rong; Hang, Chunjin; Tian, Yanhong

doi:10.1016/j.matchar.2023.113553

Materials Characterization

2024

DOI: 10.1016/j.matchar.2023.113553

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Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

He Gao,

Wei Liu,

Rong An

et al.

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Cited by 3 publications

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Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

Cited by 3 publications

References 68 publications

Electrochemical corrosion behaviors of in situ NbC-reinforced AISI H13 composites: Experimentation and first-principles study

Electrochemical corrosion behaviors of in situ NbC-reinforced AISI H13 composites: Experimentation and first-principles study

Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints

Ni and Sb improve the microstructure, mechanical properties, and solder joint reliability of Sn-3.0Ag-0.5Cu alloy

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