Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

“…A survey of the literature showed that micro/nano-sized particles of alloying elements such as silver, copper, nickel, antimony and bismuth improved the mechanical properties of a lead-free solder while simultaneously reducing the melting point [16][17][18]. In addition, various nano-sized, nonreacting, noncoarsening oxide dispersoids have been incorporated into solder alloys to create a new, improved solder structure which exhibits significantly enhanced creep resistance combined with increased strength [19].…”

The isothermal section of the Ni–Sn–Zn phase diagram at 873 K

“…In addition, Ni is considered to be a possible alternative to Cu substrate or act as a diffusion barrier over Cu because of the lower reactivity with Sn [1,4]. Moreover, Gain [5] reported that Ni nanoparticle additions to SneZn solder can increase the shear loads in ball grid array (BGA) packages. For industrial application, solder joints have to be long-lasting and resistant to frequent thermal cycles and it is therefore necessary to have information on the interfacial reactions between the solder and the substrate.…”

Effect of thin gold/nickel coating on the microstructure, wettability and hardness of lead-free tin–bismuth–silver solder

“…However, their inherent toxicity associated with lead in human health, environmental concerns and recent legislation, the advance electronic packaging industries are searching an appropriate lead-free interconnect alloy for green electronic devices as a global trend [18,19]. This has therefore promoted a search for environmental-friendly lead-free Sn-based interconnectionsincluding those associated with Sn-based alloys such as Sn-Bi (138°C), Sn-9Zn (198°C), Sn-8Zn-3Bi (189.8°C), Sn-10Sb (271°C), Sn-52In (118°C), Sn35Bi-1Ag (187°C), Sn-3.5Ag (221°C), Sn-0.7Cu (227°C) and Sn-3Ag-0.5Cu (217°C) [20][21][22][23][24][25][26][27] to substitute the toxic Sn-Pb (183°C) [28,29] solder alloys. However, there are several critical challenges such as processing parameters and material properties need to be encountered.…”