“…This was due to the ceramic reinforcements were extremely stable at high temperature and no new excessive phase will form either during the fabrication or due to the large temperature difference between the reinforcing particles and solder alloys [2,6]. Reinforcing the solder matrix with small amounts of ceramic particles including cerium oxide (CeO2) [9,10], zirconia (ZrO2) [11,12], titanium oxide (TiO2) [2,[13][14][15][16][17][18], silicon carbide (SiC) [19,20], silicon nitride (Si3N4) [21,22], iron oxide (Fe2O3) [23], strontium titanate (SrTiO3) [24], titanium carbide (TiC) [25], silicon dioxide (SiO2) [26], lanthanum oxide (La2O3) [27] and aluminium oxide (Al2O3) [28,29] have shown to improve microstructure formations, mechanical and thermal properties of solder. Li et al [9] hypothesized that the incorporation of ceramic particles in solder matrix may act as heterogenous nucleation sites for β-Sn and eutectic phase which could increase the nucleation rate and may result in smaller grain size.…”