2010
DOI: 10.1007/s10118-010-1003-9
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Effect of nanosilica on the kinetics of cure reaction and thermal degradation of epoxy resin

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Cited by 23 publications
(17 citation statements)
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“…The differential scanning calorimetry (DSC) technique was used to study the kinetics of curing reactions under non-isothermal modes [24][25][26][27][28]. A variety of kinetic models have been proposed to investigate kinetic parameters, such as Kissinger's [29,30], FlynnWall-Ozawa's [31], Kamal's [32], autocatalytic [33], and Borchardt Daniels's [34] methods. Camille et al [35] reported that montmorillonite is responsible for the decrease in the T max and the heat of the reaction of a nanocomposite compared with those of a diglycidyl ether of bisphenol A (DGEBA) system.…”
Section: Introductionmentioning
confidence: 99%
“…The differential scanning calorimetry (DSC) technique was used to study the kinetics of curing reactions under non-isothermal modes [24][25][26][27][28]. A variety of kinetic models have been proposed to investigate kinetic parameters, such as Kissinger's [29,30], FlynnWall-Ozawa's [31], Kamal's [32], autocatalytic [33], and Borchardt Daniels's [34] methods. Camille et al [35] reported that montmorillonite is responsible for the decrease in the T max and the heat of the reaction of a nanocomposite compared with those of a diglycidyl ether of bisphenol A (DGEBA) system.…”
Section: Introductionmentioning
confidence: 99%
“…In each case the peak temperature shifts from a higher value to a lower value with the change in heating rate from higher side to lower side. Slower heating rates give the sample more time to cure resulting a smaller value of peak temperature [16]. However, many equations have been developed to calculate the activation energy (E a ) for non-isothermal curing process.…”
Section: Non-isothermal Curingmentioning
confidence: 99%
“…However, many equations have been developed to calculate the activation energy (E a ) for non-isothermal curing process. In our present study, we have used Ozawa-Flynn-Wall method based on Doyle's approximation [16] for the calculation of Ea and is expressed as follows:…”
Section: Non-isothermal Curingmentioning
confidence: 99%
“…[5,8] Epoxy-silica nanocomposites can be used in adhesives, coatings, packaging materials for electronic devices, matrices of advanced composites with improved performance, and many other fields. [6,9,10] Liu et al have reported that nanoscale colloidal silica particles act as a curing agent in the curing state of epoxy-silica nanocomposite formation. It was showed an interesting reactivity of silica nanoparticles (SN) toward epoxy resins without the need of adding other catalyst in cure reaction.…”
Section: Introductionmentioning
confidence: 98%
“…It is important to study the cure kinetics and the correlation between the degree of cure and the thermal and mechanical properties to design the optimum curing conditions. [1][2][3][4][5][6][7] To provide organic-inorganic hybrid materials, we can mix the nanoscale particles with polymeric materials. [8] The hybrid materials are also known as nanocomposites.…”
Section: Introductionmentioning
confidence: 99%