Effect of Ni diffusion annealing temperature on crucial characterization of Bi-2223 superconducting system

Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure

“…Even, the material preparation process has already been shown in Ref. [18,19]. According to the results obtained, both the existence of nickel nanoparticles in the bulk Bi-2223 superconducting crystal system and annealing temperature affect remarkably the fundamental characteristic features discussed above.…”

“…At the same time, the material preparation procedure including the standard solid-state reaction route and evaporation environments was clearly provided in the experimental details of Ref. [18,19]. According to the experimental measurement findings, we declare that all the characteristic properties got found to be improve significantly in the existence of optimum Ni particles embedded into the Bi-2223 crystal lattice.…”

“…In previous studies provided in Ref. [18,19], we shed lights on the positive effects in the electrical, flux pinning, superconducting, microstructural, mechanical performance and characteristic features of Ni diffusion-layered bulk Bi-2223 copper oxide compounds annealed at the different annealing temperatures between 650 °C and 850 °C via the conventional experimental measurement methods including the transport critical current density, powder X-ray diffraction, dc electrical resistivity, and microhardness investigations and available theoretical modeling approaches. Even, the material preparation process has already been shown in Ref.…”

“…Likewise, the crucial properties given resided in the global top points until the critic annealing temperature of 700 °C above which fundamental physical quantities tend to suppress dramatically and in case of 850 °C the properties damage seriously. Hence, the previous studies cited in [18,19] display that 700 °C is the optimum annealing temperature value for the Ni diffusion-layered Bi-2223 superconductor to open up the novel, innovative and feasible market areas for the universe economy.…”

“…This study is a continuation of mechanical characterization and performance of Bi-2223 superconducting compounds subjected to the nickel impurity evaporation onto the specimen surfaces. In the previous studies [18,19], the influence of diffusion annealing temperature in a range of 650 °C-850 °C on the structural, electrical, flux pinning, superconducting properties and mechanical characterizations founded on the mechanical modellings was examined by using the dc electrical resistivity, transport critical current density, powder X-ray diffraction, and Vickers's hardness experimental measurements and theoretical approaches. At the same time, the material preparation procedure including the standard solid-state reaction route and evaporation environments was clearly provided in the experimental details of Ref.…”