2011
DOI: 10.7567/jjap.50.063101
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Effect of Ni Layer Thickness on Cu-Based {100}<001 > Textured Substrate for Coated Conductor

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Cited by 6 publications
(2 citation statements)
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“…Ni-electroplated Cu/SUS316 lamination tapes prepared by Tanaka Kikinzoku Kogyo KK (commercially available) were used as the substrates. An SUS316 tape with a thickness of 100 μm was bonded to a 30-μm-thick {100}<001> textured Cu tape, and a 0.5-μm-thick Ni layer was electro-deposited on the surface of the laminated tape (Ni/Cu/ SUS tape) 26,27) . The crystal orientation of the Ni layer in the Ni/Cu/SUS tape was 5.0 to 5.5 (full width at half maximum (FWHM) value in the X-ray (111) ϕ-scan measurement).…”
Section: Methodsmentioning
confidence: 99%
“…Ni-electroplated Cu/SUS316 lamination tapes prepared by Tanaka Kikinzoku Kogyo KK (commercially available) were used as the substrates. An SUS316 tape with a thickness of 100 μm was bonded to a 30-μm-thick {100}<001> textured Cu tape, and a 0.5-μm-thick Ni layer was electro-deposited on the surface of the laminated tape (Ni/Cu/ SUS tape) 26,27) . The crystal orientation of the Ni layer in the Ni/Cu/SUS tape was 5.0 to 5.5 (full width at half maximum (FWHM) value in the X-ray (111) ϕ-scan measurement).…”
Section: Methodsmentioning
confidence: 99%
“…A SUS316 tape with a thickness of 100 μm was bonded to a 30 μm thick {100}〈001〉 textured Cu tape to strengthen the very soft annealed pure Cu tape, and a 0.5 μm thick Ni layer was electro-deposited on the surface of the laminated tape to provide Ni/Cu/SUS316 tape. [7][8][9] The crystal orientation of the Ni layer in the Ni/Cu/SUS316 tape was 5.0 to 5.5°(full width at half maximum (FWHM) value in the X-ray (111) fscan measurement). A Nb-doped SrTiO 3 (Nb-STO) thin film of 310 nm thickness was deposited in a 3% H 2 /97% Ar atmosphere by a pulsed laser deposition (PLD) method using sintered bulk Sr(Ti 0.85 Nb 0.15 )O 3+δ as the target.…”
mentioning
confidence: 99%