Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate

Gao, He; Wei, Fuxiang; Qi, Jiqiu; He, Yuan; Meng, Qinglin

doi:10.1007/s10854-018-0490-2

Cited by 19 publications

(1 citation statement)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the continuous advancement of semiconductor manufacturing technology, the chips are developing in the direction of miniaturization, densification, and high power. − The quality of the package directly affects the performance of the chip. SnPb solder is widely used in electronic packaging due to its low price, good wettability, and low melting point. , However, the European Union passed the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substance (ROHS) directives to ban the use of Pb in electronic products due to its toxicity. , Therefore, the research on lead-free solder has become a hot topic.…”

Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

Self Cite

View full text Add to dashboard Cite

The application of Sn-0.7Cu solder in electronic packaging is limited by its high melting point, low wettability, and poor solderability. Herein, we obtain Co nanoparticles embedded in carbon skeleton nanosheets (Co&C) via a metal-organicframework (MOF)-derived method. The composite solder is successfully prepared by adding Co&C into Sn-0.7Cu. The results show that the addition of minor amounts of Co&C has little influence on the melting point of the composite solder. In addition, the wettability of the composite solder is effectively enhanced by the adsorption effect of Co&C. The minimum wetting angle of the composite solder is 27.9°when the content of Co&C is 0.08 wt %. With the addition of Co&C, the microstructure of the solder is refined, and the best refinement effect is achieved when the content of Co&C is 0.08 wt %. Furthermore, adding Co&C can reduce the thickness of the intermetallic compounds (IMCs) and transform the scalloped IMCs into a planar shape. Reflowed for 2100 s, the IMCs at the Sn-0.7Cu-0.08Co&C/Cu interface maintain a planar shape, and their thickness is reduced by 21.10% compared with that of the Sn-0.7Cu/Cu interface. The synergistic effect between Co and carbon in Co&C jointly controls the interface reaction and the growth of IMCs.

show abstract

Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

Self Cite

View full text Add to dashboard Cite

show abstract

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point

Gao

Liu

Wang

2023

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy

Eid,

Fawzy,

Mansour

et al. 2024

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Microstructure analysis, thermal behavior, and tensile creep characteristics of the Sn-1.5Ag-0.5Cu-x wt.% Ni (SAC155-xNi, x = 0, 0.05, 0.1, 0.2, and 0.5 wt.%) solder alloys have been examined. The Ni additions have greatly modified the microstructure of Ni-free alloy into bulky fibrous eutectic regions and included the contemporary (Cu, Ni)6Sn5, and (Ni, Cu)3Sn4 IMCs. Ni additions slightly increased solidus temperature and melting temperature of them. The results of tensile creep resistance have shown dependence on Ni content and testing temperatures due to bulky fibrous eutectic regions and finer IMCs. Creep rates vary with Ni content across all temperatures and stresses. The SAC155-0.05Ni alloy has the lowest and the SAC-0.0Ni alloy has the highest creep rates at all tested conditions. The delicate dispersed IMCs of Ag3Sn and Cu–Ni–Sn resulted in a significant increase in stress exponent (n$$\approx $$ ≈ 5–8), enhancing its deformation resistance. The $$n$$ n values of alloys decrease as the testing temperature rises due to a change in the dominant creep mechanism. The average values of activation energy (Q) of SAC155-xNi alloy ranged from 60.20 to 68.02 kJ/mol. These Q values are coherent to the process of pipe self-diffusion through dislocation cores.

show abstract

Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate

Cited by 19 publications

References 34 publications

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point

The role of Ni minor additions on the mechanical characteristics of Sn-1.5Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy

Contact Info

Product

Resources

About