Colloids and Surfaces A: Physicochemical and Engineering Aspect
 2025
DOI: 10.1016/j.colsurfa.2024.135457
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Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations

Chao He,
Xinhuan Niu,
Jianghao Liu
et al.
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